The rapid adoption of AI is reshaping how data centers are designed, built, and operated. As compute densities rise and power is concentrated into fewer, hotter chips, traditional air-cooled architectures are reaching their practical limits. In response, liquid cooling—particularly direct-to-chip approaches— has become central to liquid cooling system design in modern data centers. At the…
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Everyone in the data center space has experienced it: the dreaded call — “we’re down.” Even before today’s AI boom, data center outages ranked among the most damaging forms of downtime. Why? Because every minute offline pushes profitability further out of reach. According to Uptime Institute’s Annual Outages Analysis 2025 report, 54% of respondents said…
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AUSTIN, Texas – March 11, 2026 – JetCool, a Flex (NASDAQ: FLEX) company and a leading provider of end-to-end liquid cooling solutions for high-density compute, today announced it has collaborated with Broadcom to deliver liquid cooling for next-generation AI XPUs, backed by Flex’s global mass production capabilities. As AI training and inference workloads accelerate, silicon…
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Expanded partnership introduces modular cooling architectures to enable scalable, energy-efficient AI and HPC deployments. SEATTLE, WASHINGTON (January 21, 2026) – Sabey Data Centers, a leading designer, builder and operator of multi-tenant data centers, announces today an expanded partnership with JetCool, a Flex company and innovator in direct-to-chip cooling solutions for compute-intensive markets. This deepened collaboration…
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As rack densities reach 50kW+, direct liquid cooling is one of the leading solutions managing AI-driven heat loads in modern data centers, as notes Uptime Institute. When we think of liquid cooling, we think of three components: plates, pumps, and pipes. Traditionally, design conversations focus on the heat-rejecting components—cold plates and coolant distribution units (CDUs)—as…
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New rack-level demonstration in Ashburn, Virginia showcases scalable, high-density, and sustainable cooling for next-generation compute environments News summary Demonstration showcases standalone and facility-integrated single-phase direct liquid cooling (DLC) capabilities incorporated into a single OCP ORv3 rack DLC solution reduces data center water and power consumption significantly in AI and high-performance computing (HPC) environments AUSTIN, Texas…
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New scalable solution delivers flexible capacity up to 1.8 megawatts (MW) to meet evolving AI, high performance computing (HPC), and hyperscale workloads. AUSTIN, TX—September 23, 2025 – Flex (NASDAQ: FLEX), a global manufacturing leader and innovator in data center infrastructure solutions, today announced the launch of its new Modular Rack-Level Cooling Distribution Unit (CDU)—available immediately—as…
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Data center operators are facing unprecedented AI compute demands forcing them to rethink infrastructure, starting at the rack. No longer a passive enclosure, the modern rack is evolving into a complex, integrated system where power delivery, cooling systems, and component compatibility must be co-engineered from day one. Barriers to Scaling AI InfrastructureWhile the vision for…
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As AI reshapes data center power and thermal profiles, one thing is clear: air cooling alone can’t keep up. Rack densities are surging past 30kW, often reaching 100kW or more, and facility operators must face a choice: continue retrofitting an aging system or switch to liquid cooling. But for operators facing their first liquid cooling…
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As AI workloads accelerate compute density and power consumption, traditional cooling methods are no longer enough. At AI Infra Summit 2025, JetCool—a Flex company and leader in direct-to-chip liquid cooling—is showcasing how precision-engineered, end-to-end liquid cooling solutions are redefining performance, efficiency, and scalability in AI data centers. Flex + JetCool: Your One-Stop Data Center PartnerJetCool’s…
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