As processor power and rack density increase, thermal management has become a primary factor in data center design. As processor power levels rise and advanced packaging introduces more localized heat density, the limitations of traditional air-based cooling approaches are increasingly evident. Cooling remains a significant contributor to facility energy consumption, often accounting for 30 to…
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How JetCool’s liquid-cooled Dell XE7745 gives enterprises a lower-CAPEX path into high-density AI infrastructure For many enterprises, AI infrastructure has started to feel like an all-or-nothing decision: invest in rack-scale systems, redesign the facility around extreme power density, and absorb the operational risk of a new cooling architecture, or delay deployment altogether. That model does…
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New platform delivers direct-to-chip liquid cooling with end-to-end infrastructure and services, simplifying enterprise deployment of high-density AI compute AUSTIN, Texas, June 25, 2026— JetCool, a Flex (NASDAQ: FLEX) company and leading provider of advanced cooling for AI and high-density computing, today announced the launch of a liquid-cooled version of the Dell PowerEdge XE7745 server. The…
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Most data centers were not designed to support today’s compute densities. Enterprise and colocation environments were built around air cooling and rack power levels that are now being exceeded. As higher-power CPUs and GPUs are deployed, operators are being asked to deliver more compute within the same footprint, using infrastructure sized for a very different…
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Sealed, direct-to-chip cooling unlocks higher performance and efficiency with no facility water or data center retrofits required. LAS VEGAS, May 15, 2026 – JetCool, a Flex (NASDAQ: FLEX) company and leading provider of advanced cooling for AI and high-density computing, today announced the launch of its SmartPlate™ System for Dell PowerEdge R770 and R7725 servers.…
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The rapid adoption of AI is reshaping how data centers are designed, built, and operated. As compute densities rise and power is concentrated into fewer, hotter chips, traditional air-cooled architectures are reaching their practical limits. In response, liquid cooling—particularly direct-to-chip approaches— has become central to liquid cooling system design in modern data centers. At the…
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Everyone in the data center space has experienced it: the dreaded call — “we’re down.” Even before today’s AI boom, data center outages ranked among the most damaging forms of downtime. Why? Because every minute offline pushes profitability further out of reach. According to Uptime Institute’s Annual Outages Analysis 2025 report, 54% of respondents said…
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AUSTIN, Texas – March 11, 2026 – JetCool, a Flex (NASDAQ: FLEX) company and a leading provider of end-to-end liquid cooling solutions for high-density compute, today announced it has collaborated with Broadcom to deliver liquid cooling for next-generation AI XPUs, backed by Flex’s global mass production capabilities. As AI training and inference workloads accelerate, silicon…
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Expanded partnership introduces modular cooling architectures to enable scalable, energy-efficient AI and HPC deployments. SEATTLE, WASHINGTON (January 21, 2026) – Sabey Data Centers, a leading designer, builder and operator of multi-tenant data centers, announces today an expanded partnership with JetCool, a Flex company and innovator in direct-to-chip cooling solutions for compute-intensive markets. This deepened collaboration…
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As rack densities reach 50kW+, direct liquid cooling is one of the leading solutions managing AI-driven heat loads in modern data centers, as notes Uptime Institute. When we think of liquid cooling, we think of three components: plates, pumps, and pipes. Traditionally, design conversations focus on the heat-rejecting components—cold plates and coolant distribution units (CDUs)—as…
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