What is microconvective cooling®?
JetCool’s patented microconvective liquid cooling is a platform technology and the foundation that underpins our product portfolio. Microconvective cooling® uses arrays of fluid jets to cool the industry’s highest-power devices. Unlike typical heat sinks or traditional cold plates that pass fluid over a surface, our cooling jets route fluid directly at the surface, creating an order-of-magnitude improvement in heat transfer.
Find the Right Liquid Cooling Solution for your Application
Our collection of liquid-cooled products covers a wide range of applications
Our revolutionary products utilize microconvective cooling® and range from fully sealed cold plates and direct liquid-to-chip products to hotspot-targeted embedded liquid cooling and complete turn-key microconvective cooling systems. By decoupling the heat source from hotspots on wafers or chipsets, our technology can be applied across a broad spectrum of industries with thermal management requirements, such as high-performance computing (HPC), semiconductors, enterprise and data centers where performance and sustainability are critical.

Cold Plates
Fully sealed, liquid cold plates with microconvective cooling® technology

Silicon Cooling
Liquid-to-Chip cooling modules with microconvective cooling® technology

Cooling embedded in silicon with microconvective cooling® technology
- Exceptional cooling performance
- Eliminates the need for all TIM and/or thermal paste
- Can isolate specific chiplets within 2.5D/3D heterogeneous packages
