Microconvective, Microchannel and Hybrid Liquid Cooling Technologies
Advanced single-phase direct-to-chip (DTC) liquid cooling that maximizes compute performance and facility efficiency.
JetCool delivers high-performance liquid cooling solutions engineered for the intense thermal demands of artificial intelligence and advanced compute. We offer a diverse range of tailored cooling architectures including targeted fluid microjets, advanced microchannels, and hybrid combinations—optimized through precise thermal analysis of your specific silicon. This flexible, multi-architecture expertise powers our comprehensive, chip-to-rack portfolio, which spans liquid-cooled servers, Coolant Distribution Units (CDUs), smart manifolds, and quick disconnects to ensure peak efficiency across the entire data center ecosystem.
JetCool’s patented microconvective cooling® approach uses jet arrays to precisely target areas where processor heat flux is the highest.
- Minimizes heat gradients across the processor to deliver uniform temperatures and enhance longevity
- Designed to prevent drastic pressure drops at high flow intensities
Best suited for: custom accelerators, warm‑water cooling environments, direct-to-die cooling
Microchannel liquid cooling relies on parallel internal channels that maximize coolant contact surface area for uniform cooling.
- Supports efficient cooling at low to moderate flow rates, reducing IT-loop burden
- Efficient channel architecture allows for rapid design iteration and streamlined deployment
Best suited for: rapid deployments, enterprise and colocation compute
Hybrid architectures combine jet flow and microchannel elements to maximize targeted heat removal and optimize flow and pressure drop.
- Fine-tuned control over thermal design, pressure drop, and system losses
- Engineered to handle elevated or uneven thermal demands in custom silicon solutions
Best suited for: custom processor designs, mixed heat‑flux profiles, performance‑critical applications
JetCool transforms advanced liquid cooling technologies into processor-specific products designed for real-world deployment. Our portfolio includes fully sealed cold plates, direct-to-die cooling solutions, and embedded silicon cooling designs developed for platforms from Intel, AMD, NVIDIA, Broadcom, and other leading semiconductors. Each solution is tailored to the thermal and mechanical requirements of the device, helping customers achieve higher performance while simplifying integration.
Browse our cold plates for Intel processors
Learn more about our AMD processor offerings
Discover our cold plates for NVIDIA GPUs
Discover our cold plate solutions for Broadcom ASICs
Custom Cooling
Liquid-Cooled Servers
Liquid-Cooled Rack Solutions
Explore Our Solutions
Liquid-Cooled Servers
Built on single-phase, direct-to-chip technology, our server solutions range from component-level cooling to fully integrated liquid-cooled platforms. The portfolio includes cold plates, cooling modules, liquid-assisted air-cooled configurations, and fully liquid-cooled servers, enabling customers to implement liquid cooling where it delivers the greatest value and expand as infrastructure requirements grow.
Liquid-Cooled Rack Solutions
JetCool delivers integrated rack-scale liquid cooling solutions designed for the next generation of AI and high-performance computing. The portfolio spans liquid-cooled servers, manifolds and quick disconnects, coolant distribution units, and complete rack-level architectures that work together as a unified system.
Custom Cooling
JetCool partners with leading silicon innovators to solve complex thermal challenges for high-power compute. Backed by 100+ thermal experts and global engineering and manufacturing capabilities, we support advanced programs across the entire product lifecycle – from thermal concept and architecture development through prototyping, validation, and production.
Talk to an engineer today to discover the right solution for your application.