Data Centers
HPC
Electric Vehicles
Reliable,
Scalable Performance
Transform thermal management in your high-power electronic application.
Our modules are easily integrable and can handle the market’s highest power density devices.
What can better cooling do for my application?
01
Safely Run Devices Harder
Defense-grade cooling solutions help guard devices against downtime and network latency in the compute industry. For electric vehicles, our thermal management increases inverter reliability and performance.
02
Increase Device Efficiency
Microconvective direct-to-chip liquid cooling technology cools devices to maintain optimal operational temperatures, improving device efficiency and lifetime.
03
Future-Proof Design
Our compute customers future-proof system design to reliably cool the next three generations of processors, including those that exceed 1,000W per chip while our eMobilty customers enhance power module durability and lifetime.
04
Minimize Cooling Costs
For compute applications, our cooling technology reduces energy costs by up to 8% and water usage up to 90% annually. For eMobility customers, our cooling streamlines design, enabling better power output in a smaller footprint.
Loved by Engineers. Trusted by Enterprises.
Data centers are facing significant energy challenges. It is estimated that 3% of the planet’s total energy consumption is used by data centers with 30% of that attributed to cooling equipment. Learn how JetCool is transforming cooling in data centers today.
Engineers seeking to maximize compute density in high-performance computing applications are faced with thermally-bound constraints: heat causes processor throttling, local hot spots, and limits device lifetime. Read more about JetCool’s HPC solutions.
Electric vehicle manufacturers are facing a major roadblock: existing power module designs have thermal constraints, not electrical. Read more about our direct-to-chip liquid cooling for electric vehicle power modules.