UNRIVALED DIRECT-TO-CHIP LIQUID COOLING TECHNOLOGY
Drive high-power electronic performance, accelerate innovation, and maximize sustainability efforts
Increase compute power and maximize energy efficiency
Realize unmet compute potential and sustainability improvements
Develop high-performance devices with enhanced power density & improved efficiency
We strive to continuously innovate next-generation cooling technology to enable the devices that fuel a more sustainable tomorrow. Our mission drives our company forward and is embedded in everything we do.
Direct-to-Chip Liquid Cooling
High-power electronics are becoming smaller and more powerful. With more power, comes more heat. It’s now more important than ever for your cooling technology to augment, not limit, performance.
Future-proof design while reducing energy costs by up to 8% and water usage up to 90%.
Cool devices from 150W up to 1000W, eliminating hotspots in HPC applications.
Support greater CPU and GPU densities with our direct impingement cooling approach.
Transform thermal management in your high-power electronic application.
Jetcool uses small fluid jets within compact cooling modules, transforming high-power electronic cooling performance at the chip or device level. Our patented fluid-to-package/fluid-to-die cooling techniques eliminate all thermal pastes and thermal interface materials, minimizing thermal resistance.
Our modules are easily integrable and can handle the market’s highest power density devices.
What can better cooling do for my application?
The answer: a lot!
Safely Run Devices Harder
Defense-grade cooling solutions help guard devices against downtime and network latency.
Our customers future-proof system design by reliably cooling the next three generations of processors, including those that exceed 1,000W per chip.
Minimize Cooling Costs
Utilizing microconvective cooling®, our customers reduce energy costs by as much as 18% due to higher coolant temperatures of over 45°C, and slash water usage by 90%.
Loved by Engineers. Trusted by Enterprises.
Learn how JetCool is accelerating innovation in each market.
Data centers are facing significant energy challenges. It is estimated that 3% of the planet’s total energy consumption is used by data centers with 30% of that attributed to cooling equipment. Learn how JetCool is transforming cooling in data centers today.
Engineers seeking to maximize compute density in high-performance computing applications are faced with thermally-bound constraints: heat causes processor throttling, hot spots, and limits device lifetime. Read more about JetCool’s HPC solutions.
Manufacture high-performance devices with enhanced power density and improved device efficiency ahead of your competition with JetCool’s liquid-to-chip (or direct-water) cooling. Our silicon cooling integration approaches include SmartLid (fluid-to-die) and Integrated Die Cooling (embedded in silicon substrate).
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