Direct-to-Chip Liquid Cooling
Data Centers
HPC
Semiconductors
Reliable,
Scalable Performance
Transform thermal management in your high-power electronic application.
Our modules are easily integrable and can handle the market’s highest power density devices.
What can better cooling do for my application?
01
Safely Run Devices Harder
02
Increase Device Efficiency
03
Future-Proof Design
04
Minimize Cooling Costs
Loved by Engineers. Trusted by Enterprises.
Data centers are facing significant energy challenges. It is estimated that 3% of the planet’s total energy consumption is used by data centers with 30% of that attributed to cooling equipment. Learn how JetCool is transforming cooling in data centers today.
Engineers seeking to maximize compute density in high-performance computing applications are faced with thermally-bound constraints: heat causes processor throttling, hot spots, and limits device lifetime. Read more about JetCool’s HPC solutions.
Manufacture high-performance devices with enhanced power density and improved device efficiency ahead of your competition with JetCool’s liquid-to-chip (or direct-water) cooling. Our silicon cooling integration approaches include SmartLid (fluid-to-die) and Integrated Die Cooling (embedded in silicon substrate).