UNRIVALED DIRECT-TO-CHIP LIQUID COOLING TECHNOLOGY
Drive high-power electronic performance, accelerate innovation, and maximize sustainability efforts
Increase compute power and maximize energy efficiency
Realize unmet compute potential and sustainability improvements
Double power density with Jetcool's compact liquid cooling system
We strive to continuously innovate next-generation cooling technology to enable the devices that fuel a more sustainable tomorrow. Our mission drives our company forward and is embedded in everything we do.
High-power electronics are becoming smaller and more powerful. With more power, comes more heat. It’s now more important than ever for your cooling technology to augment, not limit, performance.
Future-proof design while reducing energy costs by up to 8% and water usage up to 90%.
Cool devices from 150W up to 1000W, eliminating hotspots in HPC applications.
2X the power density and increase the mean time to failure in electric vehicle power systems.
Transform thermal management in your high-power electronic application.
Jetcool uses small fluid jets within compact cooling modules, transforming high-power electronic cooling performance at the chip or device level. Our patented fluid-to-package/fluid-to-die cooling techniques eliminate all thermal pastes and thermal interface materials, minimizing thermal resistance.
Our modules are easily integrable and can handle the market’s highest power density devices.
What can better cooling do for my application?
The answer: a lot!
Safely Run Devices Harder
Defense-grade cooling solutions help guard devices against downtime and network latency in the compute industry. For electric vehicles, our thermal management increases inverter reliability and performance.
Increase Device Efficiency
Microconvective direct-to-chip liquid cooling technology cools devices to maintain optimal operational temperatures, improving device efficiency and lifetime.
Our compute customers future-proof system design to reliably cool the next three generations of processors, including those that exceed 1,000W per chip while our eMobilty customers enhance power module durability and lifetime.
Minimize Cooling Costs
For compute applications, our cooling technology reduces energy costs by up to 8% and water usage up to 90% annually. For eMobility customers, our cooling streamlines design, enabling better power output in a smaller footprint.
Loved by Engineers. Trusted by Enterprises.
Learn how JetCool is accelerating innovation in each market.
Data centers are facing significant energy challenges. It is estimated that 3% of the planet’s total energy consumption is used by data centers with 30% of that attributed to cooling equipment. Learn how JetCool is transforming cooling in data centers today.
Engineers seeking to maximize compute density in high-performance computing applications are faced with thermally-bound constraints: heat causes processor throttling, local hot spots, and limits device lifetime. Read more about JetCool’s HPC solutions.
Electric vehicle manufacturers are facing a major roadblock: existing power module designs have thermal constraints, not electrical. Read more about our direct-to-chip liquid cooling for electric vehicle power modules.
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