Sealed, direct-to-chip cooling unlocks higher performance and efficiency with no facility water or data center retrofits required.
LAS VEGAS, May 15, 2026 – JetCool, a Flex (NASDAQ: FLEX) company and leading provider of advanced cooling for AI and high-density computing, today announced the launch of its SmartPlate™ System for Dell PowerEdge R770 and R7725 servers. Designed to help enterprises and edge operators achieve more compute density per rack, the direct-to-chip solution supports next-generation platforms powered by 5th Gen AMD® EPYC™ and Intel® Xeon 6 processors.
SmartPlate systems are proven to deliver an average 13% IT power reduction, helping maximize power and floor space in new builds and existing facilities. Fully sealed and ready to install, the system improves thermal performance without facility water or data center retrofits, providing a fast, low-disruption way to adopt direct-to-chip cooling in enterprise data centers and distributed edge locations.
“SmartPlate Systems deliver real results at scale,” said Dr. Bernie Malouin, Founder of JetCool and Vice President at Flex. “By bringing SmartPlate support to Dell PowerEdge R770 and R7725 servers, we’re giving enterprises and edge operators a faster path to higher rack density and better efficiency, without requiring changes to existing facilities.”
“With firsthand experience deploying the SmartPlate System, we’ve seen how it enables direct-to-chip liquid cooling within traditional air-cooled data centers, “said John Sasser, Chief Technology Officer at JetCool partner Sabey Data Centers, one of the largest privately owned data center providers in the United States. “Using a closed-loop design, it integrates directly into the server, allowing fast, phased deployment. SmartPlate System helps improve server performance and reduce power consumption, giving customers a practical way to increase compute density and maximize their electricity and space budgets.”
Availability and Live Demo Locations
Additional information is available at jetcool.com/dell.
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Erin Knapp
Matter Communications for JetCool
JetCool@matternow.com
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Michelle Simmons
Senior Vice President, Global Investor Relations and Public Relations
(669) 242-6332
Michelle.Simmons@flex.com
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