Increase Your Rack Density & Improve Efficiency with Better Liquid Cooling
For high-density clusters in HPC systems, as the power increases, so does the heat. Our next-generation cooling technology handles the industry’s highest power processors, CPUs, GPUs, and ASICs. If you’re thermally limited, but not electrically limited, we can help.
JetCool’s high-performance computing customers have faster and more powerful processors. They leverage traditional pump cooling systems while future-proofing against lower case temperatures, even with warmer coolants. With JetCool, our customers:
Cool the most powerful devices from 150W to over 1000W
Reduce on-site energy consumption by up to 8% and water usage up to 90%
Pack more compute into less space with powerful racks from 30kW to over 100kW
Build Custom or Choose from Off-the-Shelf Solutions
Our ruggedized direct-to-chip liquid cooling solutions are built to withstand the harshest environments and most powerful devices at the board, component, and die level. Our strategic advantages include smaller modules that enable better cooling performance and increased computational power. To learn more about our products for high-performance computing, contact our team of engineers today.
The Roadmap to Unrivaled Compute Power
With JetCool’s liquid cooling modules, you can add more HPC to your cluster, increasing rack density. Put more compute performance in a smaller space. It’s that simple.
Eliminate Hot Spots
Eliminate hot spots and thermal variations with more efficient cooling technology. Remove locally elevated temperatures across the chip to increase performance.
Processors that use JetCool’s microconvective direct-to-chip cooling modules can run the same compute-heavy workloads with higher coolant temperatures, over 45°C.
Eliminate power- and water-intensive infrastructure like chillers and cooling towers reducing on-site energy consumption by up to 8% and water usage up to 90% annually.