Independent third-party testing confirms that JetCool’s patented microconvective cooling® technology outperforms conventional cold plates where it matters most: efficiency and performance. This validation reinforces what industry leaders already know – JetCool delivers high-performance cooling without the trade-offs of legacy designs.
The Tech-First Advantage: Smarter, Faster, and Built for AI at Scale
Originally developed at MIT for the Department of Defense (DoD), JetCool’s microconvective cooling is purpose-built for AI, HPC, and high-power workloads, delivering superior thermal performance without the increasing pressure drops or filtration challenges common in alternative cold plate designs.
By minimizing thermal resistance and maximizing cooling efficiency, JetCool enables higher chip performance at lower power consumption—giving hyperscalers, OEMs, and chipmakers the scalability they need for next-generation infrastructure.
Third-Party Testing Confirms JetCool’s Industry-Leading Performance
Recent third-party testing confirms that JetCool’s microconvective cooling® technology outperforms traditional cold plates across key performance metrics:
- 25% Better Thermal Resistance at Full Load – Unlike competitors that isolate cold plate performance, JetCool’s system was tested end-to-end, including the TIM layer, delivering a 25% reduction in total thermal resistance.
- Superior Cooling at Any Flow Rate – JetCool’s SmartPlate® outperformed all tested cold plates in cooling NVIDIA H100 GPUs, maintaining efficient heat dissipation across all flow rates from 1LPM+.
- Optimized for High Inlet Temperatures – Effective cooling at 50°C inlet temperatures reduces reliance on data center chillers, enabling free cooling in more climates and unlocking heat reuse opportunities.
These aren’t minor efficiency gains—they represent a fundamental leap forward in cooling technology. These results reinforce why hyperscalers, OEMs, and AI data centers are turning to JetCool for next-generation thermal management. Read more about the performance results here.
The Future of AI Cooling Starts Here
As AI and HPC workloads push infrastructure to its limits, JetCool’s microconvective cooling delivers a scalable, high-efficiency solution that enables hyperscalers to maximize GPU density, reduce cooling power, and future-proof their data centers—all without costly infrastructure overhauls.
Independent third-party validation confirms what industry leaders already know: JetCool sets the new standard for liquid cooling.
For a deeper dive into the performance data and real-world impact, read the latest white paper from Flex and JetCool to see how this breakthrough technology is shaping the future of AI cooling.
