Custom Liquid Cooling for Advanced Compute
Tailored, high-performance solutions from an expert team that supports you from concept to production.
JetCool partners with leading silicon innovators to solve complex thermal challenges for high-power compute. Backed by 100+ thermal experts, global engineering and manufacturing capabilities, we support advanced programs across the entire product lifecycle – from thermal concept and architecture development through prototyping, validation, and production. Our engineering capabilities span custom cold plates, direct-to-die cooling solutions, embedded cooling, and other advanced single-phase liquid cooling architectures. Each solution is developed to solve complex thermal challenges and unlock higher levels of compute performance.
JetCool combines deep thermal expertise, advanced product development capabilities, and global manufacturing to help customers accelerate silicon programs from concept through deployment.
Product Development (NPI)
Reliability & Validation
Global Manufacturing & Services
No single cooling architecture is right for every product, package, or workload. JetCool evaluates the thermal profile, package design, power density, mechanical constraints, reliability requirements, and manufacturing objectives of each application to determine the right cooling approach. Our engineering teams leverage several single-phase liquid cooling approaches – including patented microconvective cooling®, microchannel cooling, and hybrid architectures that combine the strengths of multiple heat transfer methods. This flexibility helps customers achieve the optimal balance of performance, manufacturability, reliability, and system integration for their advanced silicon.
SmartPlate™ Cold Plates
SmartPlate™ cold plates provide high-performance liquid cooling for advanced CPUs, GPUs, ASICs, networking silicon, AI accelerators, and custom silicon. Each solution can be engineered around the thermal and mechanical requirements of the processor and system, enabling efficient heat removal, low thermal resistance, and integration across a wide range of compute architectures.
SmartLid™ Liquid-to-Die Cooling
SmartLid™ brings liquid cooling closer to the heat source by directing coolant to the surface of the die, targeting hot spots with precision thermal management. Leveraging JetCool’s patented microconvective cooling technology, SmartLid is designed for applications where conventional cold plate architectures may not provider the thermal performance required. This approach can support high-power CPUs, GPUs, ASICs, AI accelerators, and custom silicon, enabling greater thermal control and higher density.
SmartSilicon™ On-Chip Cooling
SmartSilicon™ embeds liquid cooling directly within the semiconductor substrate, delivering thermal management at the closest possible point to the heat source. By integrating cooling into the chip itself, SmartSilicon supports ultra-high power densities, improved temperature uniformity, and next-generation packaging approaches including multi-die architectures. For silicon developers exploring future compute architectures and microfluidics, embedded cooling creates new opportunities to address thermal constraints earlier in the chip and package design process.
