Overcome Performance & Sustainability Challenges with Better Liquid Cooling
Meet SmartPlate, our fully sealed in-rack direct-to-chip liquid cooling solution for data centers. We’ve integrated our microconvective cooling® technology into a novel cold plate design with performance advantages for today’s data center, HPC, and AI applications demonstrating extensibility beyond 1,000 Watts TDP.
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Denser Compute
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Energy Savings
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Water Reduction
*over competing liquid cooling technologies
Meet SmartPlate
Simple, Scalable, & Sustainable Liquid Cooling
SmartPlate uses intelligent coupling to target the heat source on an integrated lid with microconvective cooling® and deliver the highest cooling performance and reliability for demanding applications. With SmartPlate, data centers:
- Deploy 100kW+ racks to densify compute
- Utilize 1,000W+ processors without limiting device reliability
- Minimize OPEX by balancing free cooling with evaporative cooling in any climate
The Sustainable Direct Liquid Cooling Choice
SmartPlate has a tremendous effect on sustainability in data center applications, eliminating the need for chillers, cooling towers, and facility hook-ups. Using SmartPlate, data centers can achieve a 90% reduction in water usage and 18% lower electricity consumption, averting 35M metric tons of CO2 emissions annually.
SmartPlate Outperforms the Competition
SmartPlate performance was tested against a leading manufacturer’s copper microchannel cold plate, delivering a 3X reduction in thermal resistance. Such a significant improvement in thermal resistance is a major step toward driving performance in higher TDP processors. Furthermore, because of efficient flow dynamics and hot spot targeting, SmartPlate achieved these performance levels with less pumping power than the competition, providing a more sustainable solution.
Make an Impact with a Smarter Data Center
01
Future-Proof Design
Our customers future-proof system design while reliably cooling their next three generations of processors, including those that exceed 1,000W per chip.
02
Minimize Footprint
Increase computational power and performance by packing the same compute into a 30% smaller footprint, saving on construction and infrastructure costs.
03
Lower PUE
Our ultra-low thermal resistance data center liquid cooling solutions reduce power consumption, lowering power usage effectiveness (PUE) to 1.02.
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Reduce TCO
Reduce energy costs by 18% and water usage by up to 90% annually. Eliminate power- and water-intensive infrastructure like chillers and cooling towers, reducing total cost of ownership.
Get Started with JetCool Today
