Overcome Performance & Sustainability Challenges with Better Liquid Cooling
Our microconvective cooling® technology has been integrated into a new cold plate design specifically built for today’s data center, HPC, and AI applications. Our water cooling solutions support more than 1,000 watts TDP and—compared with industry-leading microchannel cold plates—boast a threefold reduction in thermal resistance. Our fully sealed liquid cooling solutions can be placed in any standard data center rack and include our plug-and-play SmartPlate™ System or SmartPlate™ Module for those with existing infrastructure. Those looking for advanced performance can check out our liquid-to-chip technologies.
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Denser Compute
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Energy Savings
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Water Reduction
*over competing liquid cooling technologies
Meet SmartPlate System
Liquid-Assisted Air Cooling for up to 50kW Racks
Introducing our fully sealed, chassis-level, direct-to-chip liquid cooling solution for data center and edge applications. We integrated our microconvective cooling® technology into a novel cold plate design with performance advantages for today’s data center, HPC, and AI applications demonstrating extensibility beyond 1,000 Watts TDP. Capture all the benefits of liquid cooling with no facility modifications required.
Liquid Cooling Optimized for the Edge & On-Prem
SmartPlate Systems are the most effective way to cool devices, whether in a data center, on-prem or at the edge. With our plug-and-play systems, you can extend the useful lifetime of your servers and stay competitive by implementing compute-intensive AI/ML applications or clusters – all without modifications to your existing infrastructure. Our MIL-SPEC tested SmartPlate Systems work well in space-restricted, difficult deployment environments, providing the location agnostic, flexible, and scalable cooling your devices need to function at peak performance.
Meet SmartPlate Module
The Sustainable Direct Liquid Cooling Choice
SmartPlate Module has a tremendous effect on sustainability in data center applications, eliminating the need for chillers and cooling towers. Using SmartPlate Module, data centers can achieve a 90% reduction in water usage and 18% lower electricity consumption, averting 35M metric tons of CO2 emissions annually.
SmartPlate Outperforms the Competition
SmartPlate Module performance was tested against a leading manufacturer’s copper microchannel cold plate, delivering a 3X reduction in thermal resistance. Such a significant improvement in thermal resistance is a major step toward driving performance in higher TDP processors. Furthermore, because of efficient flow dynamics and hot spot targeting, SmartPlate Module achieved these performance levels with less pumping power than the competition, providing a more sustainable solution.
Make an Impact with a Smarter Data Center
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Future-Proof Design
Our customers future-proof system design while reliably cooling their next three generations of processors, including those that exceed 1,000W per chip.
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Minimize Footprint
Increase computational power and performance by packing the same compute into a 30% smaller footprint, saving on construction and infrastructure costs.
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Lower PUE
Our ultra-low thermal resistance data center liquid cooling solutions reduce power consumption, lowering power usage effectiveness (PUE) to 1.02.
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Reduce TCO
Reduce energy costs by 18% and water usage by up to 90% annually. Eliminate power- and water-intensive infrastructure like chillers and cooling towers, reducing total cost of ownership.
Whitepaper: Drive Faster Compute Sustainably
In this white paper, we explore the state of liquid cooling while discussing how widespread adoption of microconvective cooling® in the United States could save up to 11.1BkWh in electricity and 150 billion liters of water per year while averting 35 million metric tons of CO2 emissions globally. Complete the form below to read the whitepaper now.