Overcome Performance & Sustainability Challenges with Better Liquid Cooling
JetCool’s microconvective direct-to-chip liquid cooling technology provides an order-of-magnitude improvement in heat transfer, enabling data centers to minimize PUE while maximizing ROI.
Increase Rack Density &
Reduce Energy Costs
Densify compute to deliver more per rack.
At JetCool, we handle the industry’s most aggressive processors, delivering effective direct-to-chip liquid cooling for today’s CPUs, GPUs, and ASICs. Our customers:
Deploy 100kW+ racks to densify compute
Utilize 1,000W+ processors without limiting device reliability
Minimize OPEX by balancing free cooling with evaporative cooling in any climate
Read our latest case study to learn how we optimize free cooling and boost sustainability by maximizing coolant temperatures.
Build Custom or Choose from Off-the-Shelf Solutions
Our data center liquid cooling solutions are built for the most aggressive devices pushing the limits of performance. Available for use at the board, component, or die level, our cooling modules can easily be attached to existing packages and, in many cases, eliminate the need for thermal pastes, simplifying system assembly. To learn more about our products or for custom design inquiries, reach out to our team of engineers.
Make an Impact with a Smarter Data Center
Our customers future-proof system design while reliably cooling their next three generations of processors, including those that exceed 1,000W per chip.
Increase computational power and performance by packing the same compute into a 30% smaller footprint, saving on construction and infrastructure costs.
Our ultra-low thermal resistance data center liquid cooling solutions reduce power consumption, lowering power usage effectiveness (PUE) to 1.02.
Reduce energy costs up to 8% and water usage up to 90% annually. Eliminate power- and water-intensive infrastructure like chillers and cooling towers, reducing total cost of ownership.