Journal Articles & White Papers
Review our resources on our direct-to-chip liquid cooling technology to better understand how we can solve your data center, HPC, or vehicle electrification cooling challenges.
Embedded Microjets for Thermal Management of High Power-Density Electronic Devices. IEEE Transactions on Components, Packaging, and Manufacturing Technology. 2018.
Embedded Microjets for Thermal Management of High Power-Density Electronic Devices. IEEE Transactions on Components, Packaging, and Manufacturing Technology. 2018.
Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies. ASME International Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. 2021.
Embedded Microjets for Thermal Management of High Power-Density Electronic Devices. IEEE Transactions on Components, Packaging, and Manufacturing Technology. 2018.
Practical Concerns for Adoption of Microjet Cooling. ASME International Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. 2018.
Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies. ASME International Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. 2021.
Tutorials with Downloadable Simulation
Download our free tutorial to learn what your chip’s max temperature and power output could be with our microconvective cooling™ solutions. This step-by-step tutorial includes a Solidworks Simulation file you can try yourself (license required). Customize it with your device geometry for a quick answer on your project.
Read our Latest Case Studies
Learn how JetCool is accelerating innovation in each market.
Data centers are facing significant energy challenges. It is estimated that 3% of the planet’s total energy consumption is used by data centers with 30% of that attributed to cooling equipment. Learn how JetCool is transforming cooling in data centers today.
Engineers seeking to maximize compute density in high-performance computing applications are faced with thermally-bound constraints: heat causes processor throttling, local hot spots, and limits device lifetime. Read more about JetCool’s HPC solutions.
Electric vehicle manufacturers are facing a major roadblock: existing power module designs have thermal constraints, not electrical. Read more about our direct-to-chip liquid cooling for electric vehicle power modules.
Discover our Latest Expert Blog Articles
