Embedded Microjets for Thermal Management of High Power-Density Electronic Devices. IEEE Transactions on Components, Packaging, and Manufacturing Technology. 2018.
Practical Concerns for Adoption of Microjet Cooling. ASME International Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. 2018.
Download our free tutorial to learn what your chip’s max temperature and power output could be with our microconvective cooling solutions. This step-by-step tutorial includes a Solidworks Simulation file you can try yourself (license required). Customize it with your device geometry for a quick answer on your own project.