Unlock Scalable Liquid Cooling with In-Rack Manifolds and Quick Disconnect Couplings
Data center cooling shouldn’t be a puzzle. Our in-house engineered in-rack manifolds and quick disconnects—developed by Coreworks, a Flex Company, and sold through JetCool—are designed to eliminate the complexity of multi-vendor integration, enabling faster deployments and seamless scalability. Whether you’re building a new liquid cooling system or upgrading an existing one, our configurable components ensure compatibility, reliability, and speed—without the delays. With short lead times and full manufacturing control, we help you move from planning to performance in record time.
Short Lead Times
From quote to delivery—your solution moves fast.
In-House
Designed, build and quality-controlled under one roof.
Scalability
Flexible configurations for deployments of any size.
Customizable
Tailored to your specs with modular options available.
Integrated
Manifolds and disconnects designed to work together.
Configure to Order Manifolds
Our configurable in-rack manifolds are engineered for single-phase direct-to-chip cooling in high-density data centers. With short lead times and full in-house manufacturing, we deliver precision-built solutions tailored to your deployment needs. We also offer coolant distribution units (CDUs) in both in-rack and in-row configurations for seamless integration. Whether you’re scaling up or optimizing performance, our liquid cooling distribution manifolds provide reliability, flexibility, and speed.
- Adapt to standard server cabinets and support customized interfaces
- 304 stainless steel welded construction
- Blind mate manifold compatible
- Configure to order to support rack customizations
- Developed by Coreworks, A Flex Company
Reliable Quick Disconnect Couplings
UQD Series
Optimize your liquid cooling setup with our quick disconnect manifold fittings, engineered for fast, secure connections and leak-free performance. Featuring bidirectional self-sealing and steel ball locking, these connectors support scalable deployments in server nodes and racks. Trusted by top chipmakers, they offer universal compatibility across manifold configurations.
- Diameter: UQD02, UQD04, UQD06, UQD08
- Steel ball locking; Bidirectional self sealing
- Compatibility and universality
- Usually used in server node with hand insertion
- Developed by Coreworks, A Flex Company
Blind Mate Quick Disconnects
UQDB Series
Designed for flexibility and speed, our quick disconnect manifold connectors support a wide range of cooling configurations. With bidirectional sealing they ensure secure coolant flow and easy servicing. Ideal for use with liquid cooling manifolds for data centers, they help streamline installation and system expansion. These QD fittings are optimized for coolant distribution units in AI-ready, high-density environments.
- Diameter: UQDB02, UQDBO4, UQDB06, UQDB08
- Bidirectional self sealing
- Supporting radial floating with ±1mm and above
- Compatibility and universality
- Usually used in server node with blind insertion
- Developed by Coreworks, A Flex Company
Secure Quick-Release Fittings
TSZC20 Series
Our quick-release manifold fittings feature double ball valve interlocking for enhanced flow control and leak prevention. Built to withstand demanding conditions, these connectors offer dependable performance in direct liquid cooling manifold setups. Whether you’re deploying in-rack or in-row, our QD manifold fittings deliver speed, safety, and scalability.
- Diameter: 20 mm
- Connecting by double ball valve interlocking
- Strong flow capacity & low flow resistance
- Used for the connection between the manifold & pipeline network
- Developed by Coreworks, A Flex Company
Optimized Flow with Separate Inlets and Outlets
Our rack manifold designs feature dedicated inlet and outlet paths to ensure clean, efficient coolant flow throughout your system. This separation minimizes pressure drop, improves thermal performance, and simplifies balancing across multiple racks. It also streamlines installation and maintenance—reducing the risk of cross-contamination and making your liquid cooling deployment more reliable, scalable, and serviceable from day one.
Complete Liquid Cooling from Cold Plates to Manifolds
Custom manifold builds made simple—from end to end. Our streamlined process helps you quickly configure liquid cooling components with just four key inputs: rack layout, port quantity, quick disconnect type, and material/seal preferences. Working directly with a dedicated account manager, you’ll choose from our portfolio of in-house customizations to ensure compatibility, scalability, and fast lead times—so you get exactly what you need, without delays or complexity.
STEP 01
Define Your Rack and Layout
STEP 02
Choose Manifold and Port Quantity
STEP 03
Select Quick Disconnect Types
STEP 04
Choose Sealing and Materials
Don't Fall Victim to Deployment Paralysis
Stop piecing together your cooling system. Our in-rack manifolds and quick disconnects are designed to work together—engineered, manufactured, and delivered by one team.
Explore JetCool's Liquid Cooling Solutions
SmartPlate System for Dell PowerEdge Servers
SmartPlate System is a chassis-level, closed-loop, liquid-assisted air cooling solution. This system is outfitted with two enhanced cold plates that utilize our patented microconvective cooling® technology, a pump, and radiator. The cold plates directly target the processor’s hotspots, enabling the system to be more efficient and able to cool the industry’s highest power processors.
- Save an average of 15% on server power savings overnight
- Supports up to 1,500W in 2U configurations
- Maximize compute per floor tile and minimize facility floorspace with no piping or plumbing
Direct-to-Chip Single-Phase Liquid Cold Plates for HPC
JetCool’s SmartPlates are high-performance direct-to-chip liquid cooling cold plates designed to cool everything from modern processors to extreme Superchips exceeding 3,000W TDP and 500 W/cm² thermal loads. Powered by JetCool’s patented microconvective cooling® technology, SmartPlates deliver precise, high-efficiency cooling directly to chip-level hot spots—reducing thermal resistance and improving system performance.
- Supports up to 3kW TDP processors
- Outperforms traditional microchannel design by 25%, as validated by third-party testing
- Available for compute-intensive processors on the market, including AMD, Intel, NVIDIA and more
SmartSense Coolant Distribution Unit
SmartSense CDU is a high-performance, rack-mounted liquid-to-liquid Coolant Distribution Unit designed to meet the demands of GPU-dense, high-power racks. Capable of cooling up to 300kW per rack or across neighboring racks, it effectively manages heat in power-intensive environments, ensuring your data center infrastructure remains optimized for next-generation workloads.
- 300 kW of cooling per SmartSense 6U unit, with scalability up to 2.1 MW in row-level configurations
- Ultra-efficient, redundant pumps operate at low speeds (3600 RPM) for quiet, efficient, and reliable performance
- Maximize GPU utilization with warm inlet temperatures up to 60°C, run at peak performance longer, accelerate computation-intensive processes and reduce time-to-solution for AI models
