Unlock Scalable Liquid Cooling with In-Rack Manifolds and Quick Disconnect Couplings
Designed for AI and high-density computing environments, JetCool’s configurable manifolds and quick disconnects, developed by Coreworks, a Flex Company, help simplify liquid cooling deployment through flexible configurations, scalable production, and reliable serviceability. Backed by thermal engineering expertise and an end-to-end liquid cooling portfolio, JetCool helps customers navigate every stage of liquid cooling adoption, from design through deployment.
Scalable Production
From pilot builds to production deployments
Flexible Configuration
Tailored to rack, cooling and connectivity requirements
Integrated Ecosystem
Designed for ecosystem compatibility
Faster Deployment
Simplify system integration and streamline deployment
Quality & Reliability
Engineered, tested and quality-validated
Configure-to-Order Manifolds
Our in-rack manifolds deliver configurable fluid distribution for high-density, direct-to-chip liquid cooling environments. Designed to support deployment consistency and reliable operation, these solutions align with rack architecture, interface requirements, and cooling system configurations.
Features include:
- Configurable rack layouts and port quantities
- Support for standard server cabinets and customized interfaces
- Optional UQD, UQDB, BMQC, and QBMC interface configurations
- Uniform coolant distribution across all ports
- Premium stainless-steel construction for superior corrosion resistance
- Developed by Coreworks, a Flex Company
Reliable Quick Disconnect Couplings
UQD Series
Designed for server- and rack-level liquid cooling applications, UQD quick disconnects enable fast, secure fluid connections while helping minimize coolant loss during installation and servicing. Broad compatibility across liquid cooling architectures helps simplify deployment planning and long-term infrastructure growth.
Features:
- Available in UQD02, UQD04, UQD06, and UQD08 sizes
- Designed per OCP specifications
- Bidirectional self-sealing design
- Broad compatibility across manifold configurations
- Designed for hand insertion applications in server nodes
- Developed by Coreworks, a Flex Company
Blind Mate Quick Disconnects
UQDB Series
Designed for high-density liquid cooling environments where rapid installation efficiency, serviceability, and rack standardization are critical, UQDB blind-mate quick disconnects support secure fluid connections without requiring manual alignment during insertion.
Features:
- Available in UQDB02, UQDB04, UQDB06, and UQDB08 sizes
- Designed per OCP specifications
- Bidirectional self-sealing design
- Blind-mate functionality for simplified installation
- Radial floating support (±1 mm) to assist alignment during insertion
- Broad compatibility across liquid cooling configurations
- Designed for server-node applications requiring blind insertion
- Developed by Coreworks, A Flex Company
High-Flow Quick Disconnects
TSZC20 Series
Designed for manifold-to-pipeline network connections where high flow rates and efficient coolant distribution are critical to system performance. Ideal for high-flow connections between manifolds and pipeline networks.
- 20 mm connection diameter
- Double ball valve interlocking connection mechanism
- Strong flow capacity
- Low flow resistance design
- Designed for manifold-to-pipeline network connections
- Developed by Coreworks, A Flex Company
Optimized Flow with Separate Inlets and Outlets
Our rack manifold designs use dedicated inlet and outlet flow paths to support efficient coolant distribution throughout the system. This architecture helps minimize pressure losses, improve thermal performance, and simplify flow balancing across multiple racks. The result is a liquid cooling infrastructure that supports efficient operation, simplified maintenance, and scalable deployment.
Configure a Liquid Cooling Solution for Your Environment
Custom manifold solutions made simple. We work with your rack architecture, connectivity, and liquid cooling requirements to deliver configurations aligned to your infrastructure needs. From initial design through production, our streamlined approach helps accelerate deployment while supporting compatibility, scalability, and serviceability.
STEP 01
Define Your Requirements
STEP 02
Select Manifold Configuration
STEP 03
Select Quick Disconnect Types
STEP 04
Finalize Materials & Finishes
Don't Fall Victim to Deployment Paralysis
Stop piecing together your cooling system. By providing manifolds and quick disconnects designed to work together, JetCool helps simplify deployment, reduce integration risk, and support faster implementation.
Explore JetCool's Liquid Cooling Solutions
SmartPlate System for Dell PowerEdge Servers
SmartPlate System is a chassis-level, closed-loop, liquid-assisted air cooling solution. This system is outfitted with two enhanced cold plates that utilize our patented microconvective cooling® technology, a pump, and radiator. The cold plates directly target the processor’s hotspots, enabling the system to be more efficient and able to cool the industry’s highest power processors.
- Save an average of 15% on server power savings overnight
- Supports up to 1,500W in 2U configurations
- Maximize compute per floor tile and minimize facility floorspace with no piping or plumbing
Direct-to-Chip Single-Phase Liquid Cold Plates for HPC
JetCool’s SmartPlates are high-performance direct-to-chip liquid cooling cold plates designed to cool everything from modern processors to extreme Superchips exceeding 3,000W TDP and 500 W/cm² thermal loads. Powered by JetCool’s patented microconvective cooling® technology, SmartPlates deliver precise, high-efficiency cooling directly to chip-level hot spots—reducing thermal resistance and improving system performance.
- Supports up to 3kW TDP processors
- Outperforms traditional microchannel design by 25%, as validated by third-party testing
- Available for compute-intensive processors on the market, including AMD, Intel, NVIDIA and more
SmartSense Coolant Distribution Unit
SmartSense CDU is a high-performance, rack-mounted liquid-to-liquid Coolant Distribution Unit designed to meet the demands of GPU-dense, high-power racks. Capable of cooling up to 300kW per rack or across neighboring racks, it effectively manages heat in power-intensive environments, ensuring your data center infrastructure remains optimized for next-generation workloads.
- 300 kW of cooling per SmartSense 6U unit, with scalability up to 2.1 MW in row-level configurations
- Ultra-efficient, redundant pumps operate at low speeds (3600 RPM) for quiet, efficient, and reliable performance
- Maximize GPU utilization with warm inlet temperatures up to 60°C, run at peak performance longer, accelerate computation-intensive processes and reduce time-to-solution for AI models
