Precision Cold Plates Engineered for AMD EPYC Processors
JetCool SmartPlates™ are high-performance, direct-to-chip liquid cooling cold plates designed to cool everything from modern processors to extreme Superchips exceeding 3,000W TDP and 500 W/cm² thermal loads. Available as individual cold plates or as fully pre-engineered, in-series cold plate loops, SmartPlates give customers flexible deployment options—whether integrating into existing systems or enabling rapid, turnkey implementation. With targeted architectures that deliver precise, high-efficiency cooling directly to chip-level hot spots, JetCool cold plates reduce thermal resistance and improve overall system performance.
Precision Cold Plates Engineered for AMD EPYC Processors
JetCool SmartPlates™ are high-performance, direct-to-chip liquid cooling cold plates designed to cool everything from modern processors to extreme Superchips exceeding 3,000W TDP and 500 W/cm² thermal loads. Available as individual cold plates or as fully pre-engineered, in-series cold plate loops, SmartPlates give customers flexible deployment options—whether integrating into existing systems or enabling rapid, turnkey implementation. With targeted architectures that deliver precise, high-efficiency cooling directly to chip-level hot spots, JetCool cold plates reduce thermal resistance and improve overall system performance.
5th Gen AMD EPYC (Turin)
Power the 5th generation of AMD EPYC™ (“Turin”) processors with JetCool’s advanced direct-to-chip liquid cooling. Engineered for precision cooling, our cold plate solution supports dense, high-performance environments while improving efficiency across demanding AI, HPC, and virtualized workloads. Available for integration into facility-level cold plate loops or as a self-contained solution within Dell PowerEdge R7725 servers.
4th Gen AMD EPYC (Genoa)
Deliver exceptional performance using JetCool’s direct-to-chip liquid cooling solution for the 4th Generation AMD EPYC™ Processors, code-named “Genoa.” Leverage targeted liquid cooling technology to enhance the performance of AMD’s EPYC Genoa processors, optimizing high-performance computing and virtualization.
Contact Our Team for AMD Solution Technical Details
Drive performance and sustainability to hit ESG targets with liquid-cooled cold plates specifically optimized for AMD EPYC processors. Designed to maximize compute per floor tile and streamline OPEX/CAPEX, SmartPlate for AMD is an ideal solution for high-performance compute and AI applications.
Explore JetCool's Other Products
SmartPlate System for Dell PowerEdge Servers
SmartPlate System is a chassis-level, closed-loop, liquid-assisted air cooling solution. This system is outfitted with two enhanced precision DLC cold plates, pumps, and radiator. The cold plates directly target the processor’s hotspots, enabling the system to be more efficient and able to cool the industry’s highest power processors.
- Save an average of 13% on server power savings overnight
- Supports 1,500W in 2U configurations
- Maximize compute per floor tile and minimize facility floorspace with no piping or plumbing
SmartSense Coolant Distribution Unit
SmartSense CDU is a high-performance, rack-mounted liquid-to-liquid Coolant Distribution Unit designed to meet the demands of GPU-dense, high-power racks. Capable of cooling up to 300kW per rack or across neighboring racks, it effectively manages heat in power-intensive environments, ensuring your data center infrastructure remains optimized for next-generation workloads.
- 300 kW of cooling per SmartSense 6U unit
- Ultra-efficient, redundant pumps operate at low speeds for quiet, efficient, and reliable performance
- Maximize GPU utilization with warm inlet temperatures up to 60°C, run at peak performance longer, accelerate computation-intensive processes and reduce time-to-solution for AI models
SmartLid: Liquid-to-Die Cooling
SmartLid targets processor hot spots directly with fluid-to-die to densify compute performance and tackle the industry’s most powerful devices. Delivering the most effective cooling for today’s CPUs, GPUs, and ASICs, SmartLids enable engineers to:
- Optimize OPEX by balancing free cooling with evaporative cooling in most climates
- Future-proof system design with the capacity to cool the next three generations of processors, including those that exceed 1,000W per chip