*than microchannel cold plates
Increase Performance and Compute Density with Liquid-Assisted Air Cooling
SmartPlate™ System is the ideal choice for data centers, colocation facilities, and edge applications that are ready to deploy liquid cooling without modifying existing infrastructure. Our self-contained liquid cooling systems are designed to be easily deployed next to air-cooled servers, allowing for maximum data center densification. Popular with compute-intensive verticals ranging from federal and oil & gas to high frequency trading and medical applications, SmartPlate System offers a reliable, low-maintenance solution that can be deployed in nearly any environment. Start reaping the benefits of liquid cooling with SmartPlate System: the simple, scalable, and sustainable liquid cooling solution.
0
X
Denser Compute
0
%
Lower Upfront Costs*
0
kW
Air-Cooled Racks
Server-level, Direct-to-Chip Liquid Cooling
SmartPlate System is a chassis-level, closed-loop, liquid-assisted air cooling solution. This system is outfitted with two enhanced cold plates that utilize our patented microconvective cooling® technology, a pump, and radiator. The cold plates directly target the processor’s hotspots, enabling the system to be more efficient and able to cool the industry’s highest power processors. Unlike traditional liquid cooling solutions, this plug-and-play system helps our customers expedite liquid cooling deployments without any facility modifications.
Server-level, Direct-to-Chip Liquid Cooling
SmartPlate System is a chassis-level, closed-loop, liquid-assisted air cooling solution. This system is outfitted with two enhanced cold plates that utilize our patented microconvective cooling® technology, a pump, and radiator. The cold plates directly target the processor’s hotspots, enabling the system to be more efficient and able to cool the industry’s highest power processors. Unlike traditional liquid cooling solutions, this plug-and-play system helps our customers expedite liquid cooling deployments without any facility modifications.
Deploy Liquid Cooling with Lower Upfront Costs
SmartPlate System supports compute-intensive workloads, enabling customers to cool the highest power CPUs and GPUs on the market. Our customers value SmartPlate System for helping them:
- 3X denser compute then competing liquid cooling technologies
- Overclock servers while reducing latency or downtime
- Maximize compute per floor tile and minimize facility floorspace
- Save 20% on upfront costs to transition to liquid cooling compared to microchannel cold plates
The Bridge from Air to Liquid Cooling
01
Stay Competitive
Reap the benefits of liquid cooling faster than competitors with an easy, plug-and-play deployment.
02
Reduce OPEX
Reduce server-level fan power, and thus, energy consumption with a more efficient liquid cooling approach.
03
Optimize Floorspace
Pack more compute into less floorspace to maximize data center real estate with no facility modifications.
04
Increase Density
Overclock servers and achieve maximum compute performance supporting up to 50kW air-cooled racks.
01
Stay Competitive
Reap the benefits of liquid cooling faster than competitors with an easy, plug-and-play deployment.
02
Reduce OPEX
Reduce server-level fan power, and thus, energy consumption with a more efficient liquid cooling approach.
03
Optimize Floorspace
Pack more compute into less floorspace to maximize data center real estate with no facility modifications.
04
Increase Density
Overclock servers and achieve maximum compute performance supporting up to 50kW air-cooled racks.
Discover our Product Portfolio
We’ve designed and developed a variety of liquid cooling solutions to help enterprises in their transition to liquid cooling. From liquid cold plates to integrated die cooling, our product catalog supports a broad range of needs.
SmartPlate Module
SmartPlate Module is a fully-sealed cold plate that leverages our microconvective cooling® technology to provide unprecedented, energy-efficient cooling performance.
SmartLid
SmartLid targets processor hot spots directly with fluid-to-die to densify compute performance and tackle the industry’s most powerful devices.
SmartSilicon
Our in-silicon cooling solution embeds directly into the chip substrate to circulate coolant and target the die’s hotspots, increasing control over chip temperatures.
Get Started with JetCool Today
