Cold Plates for Broadcom ASICs
High-performance liquid cooling for Broadcom’s next-generation networking and AI silicon, including the Tomahawk switch and AI XPU families.
JetCool SmartPlates™ are high-performance, direct-to-chip liquid cooling cold plates designed to cool everything from modern processors to extreme AI chips exceeding 3,000W TDP and 500W/cm² thermal loads. Available as individual cold plates or as fully pre-engineered, in-series cold plate loops, SmartPlates give customers flexible deployment options—whether integrating into existing systems or enabling rapid, turnkey implementation. With targeted architectures that deliver precise, high-efficiency cooling directly to chip-level hot spots, JetCool cold plates reduce thermal resistance and improve overall system performance.
Enabling Thermal Control for 102.4 Tbps Ethernet Switching
Broadcom’s Tomahawk 6 (TH6) delivers 102.4 Tbps of Ethernet switching performance, enabling high-speed data movement across large-scale AI clusters. As bandwidth and integration increase, so does power density, making advanced thermal management critical.
JetCool provides high-performance cold plates purpose-built to cool Broadcom’s TH6 and next-generation switch silicon. Our liquid cooling solutions remove heat efficiently at the source, ensuring consistent performance, reduced thermal constraints, and reliable operation in dense AI networking environments.
As AI training and inference workloads scale, power densities in custom silicon are reaching multi-kilowatt levels, making thermal management critical to performance and reliability.
Through its collaboration with Broadcom and Flex, JetCool delivers advanced cold plates for Broadcom ASICs and AI XPUs, designed for single-phase, direct-to-chip liquid cooling. These solutions support sustained high-power operation and efficiently manage extreme heat flux, enabling consistent performance and scalable deployment in next-generation AI infrastructure.
Discover JetCool's Other Products
Liquid-Cooled Servers
Built on single-phase, direct-to-chip technology, our server solutions range from component-level cooling to fully integrated liquid-cooled platforms. The portfolio includes cold plates, cooling modules, liquid-assisted air-cooled configurations, and fully liquid-cooled servers, enabling customers to implement liquid cooling where it delivers the greatest value and expand as infrastructure requirements grow.
SmartPlate System for Dell PowerEdge Servers
SmartPlate System is a chassis-level, closed-loop, liquid-assisted air cooling solution. This system is outfitted with two enhanced precision DLC cold plates, pumps, and radiator. The cold plates directly target the processor’s hotspots, enabling the system to be more efficient and able to cool the industry’s highest power processors. Save an average of 13% on server power savings overnight and maximize compute per floor tile with self-contained liquid cooling.
SmartSense Coolant Distribution Unit
SmartSense CDU is a high-performance, rack-mounted liquid-to-liquid Coolant Distribution Unit designed to meet the demands of GPU-dense, high-power racks. Capable of cooling up to 300kW per rack or across neighboring racks, it effectively manages heat in power-intensive environments, ensuring your data center infrastructure remains optimized for next-generation workloads.