Cold Plates for Broadcom ASICs
High-performance liquid cooling for Broadcom’s next-generation networking and AI silicon, including the Tomahawk switch and AI XPU families.
Precision Cold Plates Engineered for Broadcom Silicon
JetCool SmartPlates™ are high-performance, direct-to-chip liquid cooling cold plates designed to cool everything from modern processors to extreme AI chips exceeding 3,000W TDP and 500W/cm² thermal loads. Available as individual cold plates or as fully pre-engineered, in-series cold plate loops, SmartPlates give customers flexible deployment options—whether integrating into existing systems or enabling rapid, turnkey implementation. With targeted architectures that deliver precise, high-efficiency cooling directly to chip-level hot spots, JetCool cold plates reduce thermal resistance and improve overall system performance.
Cold Plates for Broadcom Tomahawk 6 (TH6)
Enabling Thermal Control for 102.4 Tbps Ethernet Switching
Broadcom’s Tomahawk 6 (TH6) delivers 102.4 Tbps of Ethernet switching performance, enabling high-speed data movement across large-scale AI clusters. As bandwidth and integration increase, so does power density, making advanced thermal management critical.
JetCool provides high-performance cold plates purpose-built to cool Broadcom’s TH6 and next-generation switch silicon. Our liquid cooling solutions remove heat efficiently at the source, ensuring consistent performance, reduced thermal constraints, and reliable operation in dense AI networking environments.
Cold Plates for Broadcom AI XPUs
As AI training and inference workloads scale, power densities in custom silicon are reaching multi-kilowatt levels, making thermal management critical to performance and reliability.
Through its collaboration with Broadcom and Flex, JetCool delivers advanced cold plates for Broadcom ASICs and AI XPUs, designed for single-phase, direct-to-chip liquid cooling. These solutions support sustained high-power operation and efficiently manage extreme heat flux, enabling consistent performance and scalable deployment in next-generation AI infrastructure.
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