Cold Plates for Broadcom ASICs

Liquid Cooling for Tomahawk 6 and AI XPUs

Precision Cold Plates Engineered for Broadcom Semiconductors

JetCool SmartPlates™ are high-performance, direct-to-chip liquid cooling cold plates designed to cool everything from modern processors to extreme AI chips exceeding 3,000W TDP and 500W/cm² thermal loads. Available as individual cold plates or as fully pre-engineered, in-series cold plate loops, SmartPlates give customers flexible deployment options—whether integrating into existing systems or enabling rapid, turnkey implementation. With targeted architectures that deliver precise, high-efficiency cooling directly to chip-level hot spots, JetCool cold plates reduce thermal resistance and improve overall system performance.

Cold Plates for Broadcom Tomahawk 6 (TH6)

Enabling Thermal Control for 102.4 Tbps Ethernet Switching

Broadcom’s Tomahawk 6 (TH6) delivers 102.4 Tbps of Ethernet switching performance, enabling high-speed data movement across large-scale AI clusters. As bandwidth and integration increase, so does power density, making advanced thermal management critical.

JetCool provides high-performance cold plates purpose-built to cool Broadcom’s TH6 and next-generation switch silicon. Our liquid cooling solutions remove heat efficiently at the source, ensuring consistent performance, reduced thermal constraints, and reliable operation in dense AI networking environments.

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Cold Plates for Broadcom AI XPUs

As AI training and inference workloads scale, power densities in custom silicon are reaching multi-kilowatt levels, making thermal management critical to performance and reliability.

Through its collaboration with Broadcom and Flex, JetCool delivers advanced cold plates for Broadcom ASICs and AI XPUs, designed for single-phase, direct-to-chip liquid cooling. These solutions support sustained high-power operation and efficiently manage extreme heat flux, enabling consistent performance and scalable deployment in next-generation AI infrastructure.

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Explore JetCool's Other Products

SmartPlate System

Dell PowerEdge R770 liquid assisted air cooling dell liquid cooling

SmartPlate System for Dell PowerEdge Servers

SmartPlate System is a chassis-level, closed-loop, liquid-assisted air cooling solution. This system is outfitted with two enhanced cold plates that utilize precision cooling technology, a pump, and radiator. The cold plates directly target the processor’s hotspots, enabling the system to be more efficient and able to cool the industry’s highest power processors.

Save an average of 13% on server power savings overnight
Supports 1,500W in 2U configurations
Maximize compute per floor tile and minimize facility floorspace with no piping or plumbing

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SmartSense CDU

SmartSense Coolant Distribution Unit

SmartSense CDU is a high-performance, rack-mounted liquid-to-liquid Coolant Distribution Unit designed to meet the demands of GPU-dense, high-power racks. Capable of cooling up to 300kW per rack or across neighboring racks, it effectively manages heat in power-intensive environments, ensuring your data center infrastructure remains optimized for next-generation workloads.

300 kW of cooling per SmartSense 6U unit, with scalability up to 1.8 MW in row-level configurations
Ultra-efficient, redundant pumps operate at low speeds for quiet, efficient, and reliable performance
Maximize GPU utilization with warm inlet temperatures up to 60°C, run at peak performance longer, accelerate computation-intensive processes and reduce time-to-solution for AI models

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SmartLid

SmartLid: Liquid-to-Die Cooling

SmartLid targets processor hot spots directly with fluid-to-die to densify compute performance and tackle the industry’s most powerful devices. Delivering the most effective cooling for today’s CPUs, GPUs, and ASICs, SmartLids enable engineers to:

Optimize OPEX by balancing free cooling with evaporative cooling in most climates
Future-proof system design with the capacity to cool the next three generations of processors, including those that exceed 1,000W per chip

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