SmartPlate™ Cold Plates
Enable higher-density AI deployments, maximize processor performance, and reduce cooling energy consumption with single-phase direct-to-chip cold plates.
Liquid cooling for Intel® AI and enterprise.
Direct-to-chip cooling for AMD high-performance computing.
Direct liquid cooling for NVIDIA AI infrastructure.
JetCool SmartPlate™ cold plates deliver direct-to-chip liquid cooling for AI, HPC, and enterprise computing environments. Designed for today’s highest-power processors and next-generation AI platforms, SmartPlate™ cold plates can support thermal loads from 350W to those exceeding 3kW per processor, enabling reliable thermal management, higher rack densities, and efficient operation in demanding compute environments. Available as standalone cold plates or fully integrated cooling solutions, SmartPlate™ products helps organizations optimize performance, improve energy efficiency, accelerate deployment, and maximize infrastructure investments.
JetCool cold plates are engineered to deliver efficient, high‑performance cooling for today’s most demanding applications.
- Standard and custom cooling solutions
- Advanced microconvective, microchannel, and hybrid architectures available
- Warm water operation up to 60°C inlet temperatures
- Low pressure drop for improved system efficiency
Whether you’re developing a next-generation AI platform or scaling production deployments, JetCool can tailor solutions for your thermal and mechanical requirements.
JetCool provides system-ready cooling loops engineered for specific high-performance processors, delivering an all-in-one thermal solution right out of the box. Each integrated loop seamlessly combines precision piping, secure quick-disconnect couplings, and all necessary supporting hardware to ensure a flawless installation. Designed to maximize uptime and streamline deployment, these turnkey cooling loops eliminate integration guesswork and offer immediate, reliable heat dissipation for your most demanding compute workloads.
JetCool SmartPlate™ cold plates are engineered for the industry’s most demanding processors ranging from switch chips and XPUs to GPUs and ASICs. Supporting platforms from NVIDIA, AMD, Intel, Broadcom, and custom silicon providers, our single-phase direct-to-chip solutions combine proven architectures with deep thermal expertise to address application-specific heat flux and performance challenges.
Championing Sustainability
Support AI growth while reducing environmental impact. JetCool solutions improve cooling efficiency at the source, helping organizations reduce power consumption, lower operating costs, and achieve sustainability goals.
*metric tons
Warm Water Benefits
Water Conservation
Lower PUE
Cooling performance extends well beyond the processor. JetCool SmartSense CDUs (coolant distribution units) optimize liquid cooling systems by delivering rack-level coolant distribution precisely aligned to each server’s specific pressure, flow, and return temperature requirements.
- Integrated CDU + cold plate loop optimization delivers efficiency gains from chip to rack, enabling full control of the cooling ecosystem
- Configurable, rack‑level CDU performance engineered to match customer specifications for pressure, flow, and thermal targets
- Facility‑level efficiency benefits enabled by higher return temperatures—often eliminating the need for evaporative cooling in most climates and reducing overall energy and water usage
