Elevate High-Performance Computing with Direct Liquid Cooling for Intel Processors
Experience the next level of processor cooling with JetCool’s SmartPlate cold plates built for Intel’s 4th, 5th and 6th Generation Xeon processors. This direct-to-chip liquid cooling solution sets a new standard in thermal management, ensuring high-performance processors deliver optimal results, consistently.
Elevate High-Performance Computing with Direct Liquid Cooling for Intel Processors
Experience the next level of processor cooling with JetCool’s SmartPlate cold plates built for Intel’s 4th, 5th and 6th Generation Xeon processors. This direct-to-chip liquid cooling solution sets a new standard in thermal management, ensuring high-performance processors deliver optimal results, consistently.
Fully Sealed SmartPlate™ Cold Plates for Intel Processors
JetCool SmartPlate™ cold plates are fully sealed, direct-to-chip liquid cooling solutions designed to meet the thermal demands of modern processors in data center environments. Engineered for high-performance applications, they remove heat at the source to reduce thermal resistance and improve overall system performance. Available as individual cold plates, in-series cold plate loops, or integrated into select direct liquid-cooled (DLC) servers, SmartPlate enables flexible deployment across server and rack-level architectures.
Precision Cold Plates for 6th Gen Intel Xeon Processors
JetCool’s SmartPlate™ cold plate delivers single-phase, direct-to-chip liquid cooling technology for the 4th, 5th and 6th Gen Intel Xeon processors, including Sapphire Rapids (4th), Emerald Rapids (5th), Granite Rapids, and Sierra Forest (6th).
- Supports Intel LGA 4710 and 4677 sockets.
- Engineered for P-core and E-core architectures (Granite Rapids, Sierra Forest).
- Compatible with both MCC and XCC variants (Sapphire Rapids).
- Available for liquid-assisted air-cooled server configurations or direct-to-chip liquid cooling loops.
- Designed for compatibility with existing liquid cooling infrastructure.



Unlock Processor Performance with Liquid Cooling for Intel Xeon Processors
Champion sustainable and scalable high-performance computing with liquid-cooled cold plates optimized for Intel Xeon processors.
Explore JetCool's Other Products

SmartPlate System for Dell PowerEdge Servers
SmartPlate System is a chassis-level, closed-loop, liquid-assisted air cooling solution. This system is outfitted with two enhanced precision DLC cold plates, pumps, and radiator. The cold plates directly target the processor’s hotspots, enabling the system to be more efficient and able to cool the industry’s highest power processors.
- Save an average of 13% on server power savings overnight
- Supports 1,500W in 2U configurations
- Maximize compute per floor tile and minimize facility floorspace with no piping or plumbing

SmartSense Coolant Distribution Unit
SmartSense CDU is a high-performance, rack-mounted liquid-to-liquid Coolant Distribution Unit designed to meet the demands of GPU-dense, high-power racks. Capable of cooling up to 300kW per rack or across neighboring racks, it effectively manages heat in power-intensive environments, ensuring your data center infrastructure remains optimized for next-generation workloads.
- 300 kW of cooling per SmartSense 6U unit
- Ultra-efficient, redundant pumps operate at low speeds for quiet, efficient, and reliable performance
- Maximize GPU utilization with warm inlet temperatures up to 60°C, run at peak performance longer, accelerate computation-intensive processes and reduce time-to-solution for AI models

SmartLid: Liquid-to-Die Cooling
SmartLid targets processor hot spots directly with fluid-to-die to densify compute performance and tackle the industry’s most powerful devices. Delivering the most effective cooling for today’s CPUs, GPUs, and ASICs, SmartLids enable engineers to:
- Optimize OPEX by balancing free cooling with evaporative cooling in most climates
- Future-proof system design with the capacity to cool the next three generations of processors, including those that exceed 1,000W per chip
