JetCool and Flex Showcase Scalable, Rack-Level Liquid Cooling Solutions at OCP EMEA Summit

The rapid expansion of AI and high-performance computing (HPC) is driving unprecedented power densities in data centers. As GPUs and high-power processors push beyond 1000W per socket, traditional air and liquid cooling solutions are falling behind. Thermal management is now a limiting factor in AI scalability, making direct-to-chip liquid cooling essential for sustaining high compute performance.

At OCP EMEA Summit in Dublin, Ireland, JetCool and Flex will demonstrate their end-to-end liquid cooling offerings designed to meet the thermal and power challenges of AI, HPC, and cloud infrastructure. By combining compute, power distribution, and liquid cooling into an integrated solution, JetCool and Flex are eliminating thermal bottlenecks and delivering a scalable solution for the next generation of data centers.

Flex, a global leader in data center infrastructure solutions, engineers customizable compute and power systems for hyperscale and enterprise customers. Now, with JetCool’s direct-to-chip liquid cooling technology fully embedded within its architecture, Flex is offering an AI-ready platform that delivers maximum thermal efficiency, higher compute density, and seamless integration.

Unlike traditional rack-level deployments where cooling is often an afterthought, Flex and JetCool deliver a unified, end-to-end infrastructure that integrates:

• High-power compute platforms – Modular, liquid-cooled GPU and CPU platforms
• Advanced power distribution – Efficient rack-level power conversion and delivery
• Direct-to-chip liquid cooling – SmartPlate™ technology for optimal heat dissipation
• SmartSense CDU – High-capacity liquid distribution scaled for AI workloads

This vertically-integrated approach eliminates inefficiencies, reduces power consumption, and ensures data centers can scale AI workloads without hitting thermal limits.

First introduced at OCP Global Summit 2024, SmartSense CDU is now available for preorder, marking a major advancement in AI-optimized liquid cooling. Built to handle the extreme power demands of modern AI and HPC infrastructure, SmartSense delivers up to 300kW of cooling per rack and scales beyond 2MW at the row level—outperforming traditional CDUs in both efficiency and capacity.

Designed for seamless integration, SmartSense supports 42-inch+ deep racks in both 19-inch and ORV3 form factors, enabling effortless deployment in GPU-dense environments. With warm inlet temperature support up to 60°C and redundant pump systems, it maximizes uptime while minimizing energy consumption—keeping high-power processors running at full speed.

See SmartSense in action at OCP EMEA Summit and discover how its high-efficiency liquid distribution can future-proof your AI infrastructure.

Date & Time: 29 April 2025 at 14:25

Location: Level 1 – The Forum, Expo Hall Stage

Take a deeper dive into Flex and JetCool’s vertically-integrated rack-level liquid cooling solutions during our executive session at OCP EMEA. Led by Ludwig Haber, VP of Advanced Projects at JetCool, and Eoghan Dillon, Sr. Director of Strategy and Solution Design at Flex, they will expand on:

• Industry-Leading Integration & Global Scale – Flex’s comprehensive product portfolio, from advanced manufacturing and power distribution to cooling technologies and lifecycle services that support deployment, operation, and long-term system reliability.
• SmartSense CDU Efficiency – A deeper exploration of SmartSense CDU, focusing on its cooling capacity, scalability, and the operational advantages it offers for high-density environments.
• Best-in-Class Liquid Cooling – SmartPlate technology’s performance advantage, providing 25% better thermal efficiency than microchannels to ensure high-wattage processors maintain peak output.

JetCool and Flex will showcase the following innovative solutions at the OCP EMEA Summit, highlighting how they address the challenges of power and heat management in today’s data centers:

• Flex’s Liquid-Cooled Modular Compute Platform – Designed for seamless scalability, this platform is optimized for GPU acceleration, making it an ideal solution for AI, machine learning, and other GPU-intensive workloads.
• Flex’s 1OU and 2OU Cloud Servers – These high-performance cloud servers are engineered for hyperscale environments and feature JetCool’s SmartPlate direct-to-chip liquid cooling.
• JetCool’s Live NVIDIA GB200 Demo – Experience the future of GPU cooling with a real-time demo of JetCool’s SmartPlate for the NVIDIA GB200.
• JetCool’s SmartSense CDU – Explore our high-capacity, rack-mounted coolant distribution unit can handle up to 300kW per rack and 2MW+ at the row level.
• JetCool’s SmartPlate System – Witness our self-contained liquid cooling system for the Dell PowerEdge R760, delivering an average of 15% power savings.

Attendees at OCP EMEA Summit can experience JetCool’s portfolio of liquid cooling solutions firsthand. Visit booth #A18 and stop by our executive session on Tuesday, April 29 to learn how we’re solving the challenges of power, heat and scale in the data center.

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