Most data centers were not designed to support today’s compute densities. Enterprise and colocation environments were built around air cooling and rack power levels that are now being exceeded. As higher-power CPUs and GPUs are deployed, operators are being asked to deliver more compute within the same footprint, using infrastructure sized for a very different…
The rapid adoption of AI is reshaping how data centers are designed, built, and operated. As compute densities rise and power is concentrated into fewer, hotter chips, traditional air-cooled architectures are reaching their practical limits. In response, liquid cooling—particularly direct-to-chip approaches— has become central to liquid cooling system design in modern data centers. At the…
Everyone in the data center space has experienced it: the dreaded call — “we’re down.” Even before today’s AI boom, data center outages ranked among the most damaging forms of downtime. Why? Because every minute offline pushes profitability further out of reach. According to Uptime Institute’s Annual Outages Analysis 2025 report, 54% of respondents said…
As rack densities reach 50kW+, direct liquid cooling is one of the leading solutions managing AI-driven heat loads in modern data centers, as notes Uptime Institute. When we think of liquid cooling, we think of three components: plates, pumps, and pipes. Traditionally, design conversations focus on the heat-rejecting components—cold plates and coolant distribution units (CDUs)—as…
Data center operators are facing unprecedented AI compute demands forcing them to rethink infrastructure, starting at the rack. No longer a passive enclosure, the modern rack is evolving into a complex, integrated system where power delivery, cooling systems, and component compatibility must be co-engineered from day one. Barriers to Scaling AI InfrastructureWhile the vision for…
As AI reshapes data center power and thermal profiles, one thing is clear: air cooling alone can’t keep up. Rack densities are surging past 30kW, often reaching 100kW or more, and facility operators must face a choice: continue retrofitting an aging system or switch to liquid cooling. But for operators facing their first liquid cooling…
As AI workloads accelerate compute density and power consumption, traditional cooling methods are no longer enough. At AI Infra Summit 2025, JetCool—a Flex company and leader in direct-to-chip liquid cooling—is showcasing how precision-engineered, end-to-end liquid cooling solutions are redefining performance, efficiency, and scalability in AI data centers. Flex + JetCool: Your One-Stop Data Center PartnerJetCool’s…
As artificial intelligence (AI) and high-performance computing (HPC) workloads continue to expand in scale and intensity, cooling infrastructure has become a key design consideration. Facilities that were once optimized for general-purpose IT now face thermal loads that can exceed 30 kW per rack, and in hyperscale deployments, power densities can surpass 100 kW. Consequently, traditional…
Dell OEM Partner for End-to-End Liquid Cooling Solutions JetCool, a Flex Company, is expanding its partnership with Dell Technologies as an Original Equipment Manufacturer (OEM) Partner, introducing a new generation of its SmartPlate™ System purpose-built for Dell’s latest PowerEdge platforms. Designed for high-density compute and AI workloads, this next-generation SmartPlate System will be available on…
Flex’s (NASDAQ: FLEX) liquid cooling business, JetCool, today announced the introduction of its SmartSense Coolant Distribution Unit (CDU). This in-rack, liquid-to-liquid design is the first in a portfolio that delivers modular, cost-effective solutions to data centers and colocation providers, cooling up to 300kW in a single rack or across multiple high-density racks from a single…