AUSTIN, Texas – March 11, 2026 – JetCool, a Flex (NASDAQ: FLEX) company and a leading provider of end-to-end liquid cooling solutions for high-density compute, today announced it has collaborated with Broadcom to deliver liquid cooling for next-generation AI XPUs, backed by Flex’s global mass production capabilities. As AI training and inference workloads accelerate, silicon…
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Expanded partnership introduces modular cooling architectures to enable scalable, energy-efficient AI and HPC deployments. SEATTLE, WASHINGTON (January 21, 2026) – Sabey Data Centers, a leading designer, builder and operator of multi-tenant data centers, announces today an expanded partnership with JetCool, a Flex company and innovator in direct-to-chip cooling solutions for compute-intensive markets. This deepened collaboration…
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As rack densities reach 50kW+, direct liquid cooling is one of the leading solutions managing AI-driven heat loads in modern data centers, as notes Uptime Institute. When we think of liquid cooling, we think of three components: plates, pumps, and pipes. Traditionally, design conversations focus on the heat-rejecting components—cold plates and coolant distribution units (CDUs)—as…
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New rack-level demonstration in Ashburn, Virginia showcases scalable, high-density, and sustainable cooling for next-generation compute environments News summary Demonstration showcases standalone and facility-integrated single-phase direct liquid cooling (DLC) capabilities incorporated into a single OCP ORv3 rack DLC solution reduces data center water and power consumption significantly in AI and high-performance computing (HPC) environments AUSTIN, Texas…
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New scalable solution delivers flexible capacity up to 1.8 megawatts (MW) to meet evolving AI, high performance computing (HPC), and hyperscale workloads. AUSTIN, TX—September 23, 2025 – Flex (NASDAQ: FLEX), a global manufacturing leader and innovator in data center infrastructure solutions, today announced the launch of its new Modular Rack-Level Cooling Distribution Unit (CDU)—available immediately—as…
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Data center operators are facing unprecedented AI compute demands forcing them to rethink infrastructure, starting at the rack. No longer a passive enclosure, the modern rack is evolving into a complex, integrated system where power delivery, cooling systems, and component compatibility must be co-engineered from day one. Barriers to Scaling AI InfrastructureWhile the vision for…
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As AI reshapes data center power and thermal profiles, one thing is clear: air cooling alone can’t keep up. Rack densities are surging past 30kW, often reaching 100kW or more, and facility operators must face a choice: continue retrofitting an aging system or switch to liquid cooling. But for operators facing their first liquid cooling…
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As AI workloads accelerate compute density and power consumption, traditional cooling methods are no longer enough. At AI Infra Summit 2025, JetCool—a Flex company and leader in direct-to-chip liquid cooling—is showcasing how precision-engineered, end-to-end liquid cooling solutions are redefining performance, efficiency, and scalability in AI data centers. Flex + JetCool: Your One-Stop Data Center PartnerJetCool’s…
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As artificial intelligence (AI) and high-performance computing (HPC) workloads continue to expand in scale and intensity, cooling infrastructure has become a key design consideration. Facilities that were once optimized for general-purpose IT now face thermal loads that can exceed 30 kW per rack, and in hyperscale deployments, power densities can surpass 100 kW. Consequently, traditional…
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Dell OEM Partner for End-to-End Liquid Cooling Solutions JetCool, a Flex Company, is expanding its partnership with Dell Technologies as an Original Equipment Manufacturer (OEM) Partner, introducing a new generation of its SmartPlate™ System purpose-built for Dell’s latest PowerEdge platforms. Designed for high-density compute and AI workloads, this next-generation SmartPlate System will be available on…
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