Flex Expands Liquid Cooling Footprint at Equinix Co-Innovation Facility
New rack-level demonstration in Ashburn, Virginia showcases scalable, high-density, and sustainable cooling for next-generation compute…
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Journal Articles & White Papers
Review our resources on our direct-to-chip liquid cooling technology to better understand how we can solve your data center, HPC, or vehicle electrification cooling challenges.
Embedded Microjets for Thermal Management of High Power-Density Electronic Devices. IEEE Transactions on Components, Packaging, and Manufacturing Technology. 2018.
Practical Concerns for Adoption of Microjet Cooling. ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. 2018.
Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies. ASME International Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. 2021.
Embedded Microjets for Thermal Management of High Power-Density Electronic Devices. IEEE Transactions on Components, Packaging, and Manufacturing Technology. 2018.
Practical Concerns for Adoption of Microjet Cooling. ASME International Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. 2018.
Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies. ASME International Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. 2021.
Read our Latest Case Studies
Learn how JetCool is accelerating innovation in each market.
Data Centers
Data centers are facing significant energy challenges. It is estimated that 3% of the planet’s total energy consumption is used by data centers with 30% of that attributed to cooling equipment. Learn how JetCool is transforming cooling in data centers today.
HPC
Engineers seeking to maximize compute density in high-performance computing applications are faced with thermally-bound constraints: heat causes processor throttling, local hot spots, and limits device lifetime. Read more about JetCool’s HPC solutions.
Colocations
With investments in AI and HPC, more companies are looking for colocation facilities that can support high-density IT deployments. SmartPlate System is a practical and cost-effective solution that allows customers to deploy higher density servers in air-cooled facilities.
Discover our Latest Expert Blog Articles
Flex Expands Data Center Cooling Portfolio with Launch of Modular Rack-Level Coolant Distribution Unit
New scalable solution delivers flexible capacity up to 1.8 megawatts (MW) to meet evolving AI,…
Inside the Rack: How JetCool and Flex Deliver Turnkey Racks for AI Cooling
Data center operators are facing unprecedented AI compute demands forcing them to rethink infrastructure, starting…
Air to Liquid Migration Guide: How to Plan Your First Liquid Cooling Deployment
As AI reshapes data center power and thermal profiles, one thing is clear: air cooling…
JetCool to Showcase Cooling Demos with Flex at AI Infra Summit
As AI workloads accelerate compute density and power consumption, traditional cooling methods are no longer…
Coolant Distribution Units for AI: Choosing the Right Fit for Your Data Center
As artificial intelligence (AI) and high-performance computing (HPC) workloads continue to expand in scale and…
JetCool Expands Dell Partnership to Serve as OEM Partner, Announces SmartPlate™ System for New Dell PowerEdge Platforms
Dell OEM Partner for End-to-End Liquid Cooling Solutions JetCool, a Flex Company, is expanding its…
Flex’s Liquid Cooling Business Expands Portfolio with High-Performance Coolant Distribution Unit for AI and HPC Applications
Flex’s (NASDAQ: FLEX) liquid cooling business, JetCool, today announced the introduction of its SmartSense Coolant…
JetCool SmartLids™: Exploring Leading-Edge Cooling for Multi-Die High-TDP Processors
Introduction As anyone in the industry knows, the need for greater computational power drives evolutionary…
JetCool and Flex Showcase Scalable, Rack-Level Liquid Cooling Solutions at OCP EMEA Summit
The rapid expansion of AI and high-performance computing (HPC) is driving unprecedented power densities in…
Third-Party Testing Confirms JetCool’s Industry-Leading Performance Over Microchannel Cold Plates
Independent third-party testing confirms that JetCool’s patented microconvective cooling® technology outperforms conventional cold plates where…
Can Liquid Cooling Extend GPU Lifespan?
Understanding the Real Impact of Thermal Management on GPU Reliability The relentless growth of artificial…
The Ultimate Guide to Coolant Distribution Units (CDUs) for AI and HPC: JetCool’s SmartSense CDU Completes In-Rack Liquid Cooling Solution
As data centers transition from air cooling to liquid cooling to meet escalating power and…
How Does Direct-to-Chip Liquid Cooling Support the Future of AI Inferencing?
Is AI inferencing the greatest challenge the data center world has ever faced? Perhaps. To…
Flex Acquires JetCool to Expand Data Center and Power Portfolio
The addition of advanced liquid cooling technology addresses increased heat requirements across the full spectrum…