JetCool, a leading manufacturer in direct-to-chip liquid cooling for data centers, will exhibit at the Supercomputing Conference 2024 (SC24), highlighting innovative cooling solutions developed with Flex to address the surging demands of AI and high-density computing. Together, JetCool and Flex deliver reliable, advanced, and scalable liquid-cooled compute solutions that redefine efficiency and performance in data centers.
At SC24, JetCool will showcase its latest liquid cooling technologies tailored to meet the requirements of hyperscalers, cloud providers, and enterprises deploying AI-enabled applications. Central to JetCool’s exhibit is its partnership with Flex, focusing on purpose-built cooling solutions designed for AI servers and high-performance computing (HPC) workloads. This collaboration includes a new line of OCP-compliant, liquid cooling-ready system designs, co-developed with Flex, offering seamless rack-level integration and efficient deployment at scale.
Flex and JetCool’s Collaborative Innovation for High-Performance Compute
Flex’s vertical integration and global manufacturing capabilities, combined with JetCool’s patented microconvective liquid cooling, enable a complete server and cooling solution that adapts to high-power density demands. These servers incorporate JetCool’s microjet technology, which targets processor hotspots for efficient heat management, sustaining peak performance even under demanding workloads. JetCool’s technology manages thermal challenges by cooling devices over 3kW and supporting compute systems at row level with their high-capacity, in-rack Coolant Distribution Unit (CDU) capable of 300kW and scalable to 2.1MW.
A Partnership Delivering End-to-End Cooling Solutions for AI
“As AI and other high-density workloads push the limits of conventional cooling methods, the need for advanced solutions becomes critical,” said Dr. Bernie Malouin, CEO of JetCool. “Partnering with Flex allows us to combine our cutting-edge liquid cooling solutions with Flex’s unparalleled manufacturing capabilities. Together, we are poised to deliver servers and liquid-cooled racks for AI at scale that meet and exceed the performance and efficiency requirements of hyperscalers and enterprise customers.”
JetCool’s SmartPlate™ for the NVIDIA GB200 will be running live at SC24
Products on Display at SC24
JetCool will demonstrate the following solutions at SC24, showcasing how they meet today’s power and heat management challenges:
- SmartPlates™ – Advanced liquid cooling plates for efficient heat management, cooling over 3kW in a single device.
- CDU – JetCool’s in-rack Coolant Distribution Unit (CDU), designed to manage 300kW with scalability up to 2.1MW.
- Flex Liquid-Cooled Rack Solution – A rack-level system built to address high-power density needs with Flex’s manufacturing expertise.
- SmartPlate System (SPS) – Self-contained liquid cooling system designed for Dell PowerEdge servers, eliminating the need for facility piping or plumbing, making it an ideal bridge for transitioning to liquid cooling.
Visit JetCool and Flex at SuperCompute 2024
Attendees at SuperCompute 2024 can experience JetCool’s portfolio of liquid cooling solutions firsthand. Visit JetCool’s booth #2651 to learn how, together, we’re delivering solutions that tackle power, heat, and scale challenges faced by data centers today.
