The rapid expansion of AI and high-performance computing (HPC) is driving unprecedented power densities in data centers. As GPUs and high-power processors push beyond 1000W per socket, traditional air and liquid cooling solutions are falling behind. Thermal management is now a limiting factor in AI scalability, making direct-to-chip liquid cooling essential for sustaining high compute…
The addition of advanced liquid cooling technology addresses increased heat requirements across the full spectrum of AI workloads and high-performance computing Austin, Texas, November 14, 2024 – Flex (NASDAQ: FLEX) announced today it has acquired JetCool Technologies, a leading liquid cooling company for data centers. The acquisition bolsters Flex’s data center and power portfolio to help hyperscale and…
As artificial intelligence adoption continues to rise in enterprise and academia, legacy data centers worldwide are seeking innovative solutions to manage high-density AI workloads within existing power budgets. The University of Pisa, a prestigious public institution and research center, is no exception. By deploying the latest technologies, the University is driving sustainability in data center…
The demand for semiconductor chips continues to grow globally, outpacing supply constraints in a global market that has been hit hard by pandemic-driven supply chain woes. Now, ASML, the keystone producer of the lithography machines used to make advanced semiconductor chips, anticipates a two-year shortage for the industry due to shortages of necessary parts for…