JetCool SmartLids™: Exploring Leading-Edge Cooling for Multi-Die High-TDP Processors
Introduction As anyone in the industry knows, the need for greater computational power drives evolutionary changes in processor design. Today we’re seeing an accelerating shift from traditional, monolithic single-die configurations toward more advanced, chiplet-based multi-die processor assemblies, with growth at up to a 86% CAGR depending on the market segment. This shift, though desirable for…