Liquid Cooling for AI & HPC

Solving Thermal Challenges to Drive Performance & Efficiency

Deploy the Most Compute-Intensive AI Workloads with Microconvective Liquid Cooling

AI is hotter than ever. With AI servers that consume over 14kW at peak load on the roadmap, enterprises, colocation providers and hyperscalers all need proven cooling technologies to support the challenging heat production caused by AI training and inference clusters that can exceed more than 100kW per rack. At JetCool, our microconvective direct liquid cooling (DLC) for AI, offered in three form factors, gives our customers a wide range of technologies tailored for specific demands: SmartPlate System, SmartPlate, and SmartLid.

Faster Processing Speed

Cooling Energy Savings

TDP Support

Meet SmartPlate System

overhead view of Dell poweredge r760 with jetcool smartplate system liquid-assisted air cooling installed

Get Started with AI using Self-Contained Liquid Cooling

SmartPlate System is a self-contained, plug-and-play liquid cooling solution for Dell PowerEdge servers. Integrated into multiple server form factors, it meets diverse AI requirements efficiently. Achieving up to 50kW rack densities without requiring a CDU, SmartPlate System saves an average of 15% total server power and reduces server noise by 13dBA. This makes it a perfect choice for distributed AI at the edge or in power-constrained environments.

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Meet SmartPlate

The Sustainable Direct Liquid Cooling Choice

SmartPlates, our fully-sealed cold plates, efficiently cool the industry’s highest power AI devices, clocking in at over 3,000W TDP, and popular in hyperscale deployments. By utilizing hot inlet coolant temperatures above 50°C, SmartPlates enable facilities to eliminate the need for chillers and cooling towers, all while maximizing compute performance, processor lifespan, and power efficiency. Our patented microconvective liquid cooling technology allows SmartPlates to outperform microchannels by up to 40%, delivering a 37% temperature reduction.

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Meet SmartLid

Target Chip Hot Spots Directly with Liquid-to-Die Cooling

SmartLid is a favorite for semiconductor manufacturers, chipmakers, and foundries, including the leading designers of CPUs and GPUs. A liquid-to-chip solution that eliminates all thermal pastes and interface materials, it supports over 2,000W in a single socket. This revolutionary cooling approach boasts an impressive heat transfer coefficient 10X greater than other methods making it the perfect choice for devices striving to be more powerful, efficient, and compact. SmartLid deployments in federal labs are improving efficiencies with coolant temperatures over 60°C and eliminating water consumption.

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Meet SmartLid

smartlife semiconductor ai liquid cooling

Target Chip Hot Spots Directly with Liquid-to-Die Cooling

Our liquid-to-chip solution, SmartLid, offers exceptional HPC data center cooling performance bringing fluid directly to the processing chip. Minimizing thermal resistance by eliminating all thermal pastes and interface materials, SmartLid enables better system performance and efficiency. This revolutionary cooling approach boasts an impressive heat transfer coefficient 10X greater than other methods making it the perfect choice for devices striving to be more powerful, efficient, and compact. Our SmartLid deployments in federal labs are improving efficiencies with coolant temperatures up to 130°F and no water consumption. Tackle challenging HPC cluster cooling requirements directly at the source with our direct-to-die liquid cooling solutions.

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The Roadmap to Unrivaled Compute Power

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Maximize Compute

With JetCool’s liquid cooling modules, you can add more HPC to your cluster, increasing rack density. Put more compute performance in a smaller space. It’s that simple.

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Eliminate Hot Spots

Eliminate hot spots and thermal variations with more efficient cooling technology. Remove locally elevated temperatures across the chip to increase performance.

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Warmer Coolants

Processors that use JetCool’s microconvective direct-to-chip cooling modules can run the same compute-heavy workloads with higher coolant temperatures, over 60°C.

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Reduce TCO

Eliminate power- and water-intensive infrastructure like chillers and cooling towers reducing on-site energy consumption by up to 18% and enable zero water consumption.

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