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Maximize performance and densify compute with JetCool's advanced liquid cooling solutions

Liquid Cooling for Intel Sapphire Rapids

Elevate High-Performance Computing with Unrivaled Direct-to-Chip Liquid Cooling

Experience the next level of processor cooling with JetCool’s SmartPlate, built for Intel’s 4th Generation Xeon Scalable Processor, Sapphire Rapids. This direct-to-chip liquid cooling solution sets a new standard in thermal management, ensuring high-performance processors deliver optimal results, consistently.

Water Conservation

Lower Thermal Resistance

Denser Compute

compared to microchannel cold plates

Advanced AI and High-Performance Computing Optimized with Direct-to-Chip Liquid Cooling

Eco-Friendly and Efficient: SmartPlate is not just an advanced cooling solution for Intel Sapphire Rapids; it’s a step towards greener computing. Specifically designed to meet the rigorous thermal demands of AI and compute-intensive tasks, it excels in reducing energy consumption, promoting sustainable computing practices.

Superior Performance: The SmartPlate sets a new benchmark in cooling technology. It offers:

40% Lower Thermal Resistance: Compared to the leading direct liquid cooling (DLC) products, SmartPlate showcases a significant 40% reduction in thermal resistance, enhancing cooling efficiency substantially.
Universal Compatibility: Engineered for versatility, SmartPlate is compatible with most existing liquid cooling infrastructures. It also offers comprehensive solutions through our trusted partners, ensuring seamless integration with your current systems.

Advanced AI and High-Performance Computing Optimized with Direct-to-Chip Liquid Cooling

Superior Performance: The SmartPlate sets a new benchmark in cooling technology. It offers:

40% Lower Thermal Resistance: Compared to the leading direct liquid cooling (DLC) products, SmartPlate showcases a significant 40% reduction in thermal resistance, enhancing cooling efficiency substantially.
Universal Compatibility: Engineered for versatility, SmartPlate is compatible with most existing liquid cooling infrastructures. It also offers comprehensive solutions through our trusted partners, ensuring seamless integration with your current systems.

jetcool smartplate vs microchannel performance | intel sapphire rapids cold plate

Outperform the Competition: Unlock Processor Performance with Liquid Cooling for Intel Sapphire Rapids

Champion sustainable and scalable high-performance computing with liquid-cooled cold plates optimized for Intel Sapphire Rapids. Engineered to boost compute density and enhance processor performance, SmartPlate is the ideal solution for AI and HPC workloads, outperforming its microchannel competitors with a 3X denser compute.

Discover our Product Portfolio

We’ve designed and developed a variety of liquid cooling solutions to help enterprises in their transition to liquid cooling. From liquid cold plates to integrated die cooling, our product catalog supports a broad range of needs.

NVIDIA H100 Cold Plate

Be the first to experience our fully-sealed, low-profile liquid cooling module, optimizing cooling and density for NVIDIA H100 PCIe cards.

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SmartLid

SmartLid targets processor hot spots directly with fluid-to-die to densify compute performance and tackle the industry’s most powerful devices.

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SmartSilicon

Our in-silicon cooling solution embeds directly into the chip substrate to circulate coolant and target the die’s hotspots, increasing control over chip temperatures.

Learn More

Discover our Product Portfolio

NVIDIA H100 GPU Liquid Cooling Solution - JetCool

NVIDIA H100 Cold Plate

Be the first to experience our fully-sealed, low-profile liquid cooling module, optimizing cooling and density for NVIDIA H100 PCIe cards, shipping Q1 2024.

Learn More

SmartLid

SmartLid targets processor hot spots directly with fluid-to-die to densify compute performance and tackle the industry’s most powerful devices.

Learn More

SmartSilicon

Our in-silicon cooling solution embeds directly into the chip substrate to circulate coolant and target the die’s hotspots, increasing control over chip temperatures.

Learn More