Drive Compute-Intensive Workloads with JetCool's Liquid-Cooled SmartPlates for AMD EPYC Genoa
Deliver exceptional performance using JetCool’s direct-to-chip liquid cooling solution for the 4th Generation AMD EPYC™ Processors, code-named “Genoa.” Leverage targeted liquid cooling technology to enhance the performance of AMD’s EPYC Genoa processors, optimizing high-performance computing and virtualization.
Surpass the Competition with JetCool's SmartPlate for AMD EPYC Genoa
Drive performance and sustainability to hit ESG targets with liquid-cooled cold plates specifically optimized for AMD EPYC Genoa processors. Designed to maximize compute per floor tile and streamline OPEX/CAPEX, SmartPlate for AMD Genoa is an ideal solution for high-performance compute and AI applications.
Explore JetCool's Other Products
SmartPlate System for Dell PowerEdge Servers
SmartPlate System is a chassis-level, closed-loop, liquid-assisted air cooling solution. This system is outfitted with two enhanced cold plates that utilize our patented microconvective cooling® technology, a pump, and radiator. The cold plates directly target the processor’s hotspots, enabling the system to be more efficient and able to cool the industry’s highest power processors.
- Save an average of 15% on server power savings overnight
- Supports 850W in 1U configurations and 1,200W in 2U configurations
- Maximize compute per floor tile and minimize facility floorspace with no piping or plumbing
SmartSense Coolant Distribution Unit
SmartSense CDU is a high-performance, rack-mounted liquid-to-liquid Coolant Distribution Unit designed to meet the demands of GPU-dense, high-power racks. Capable of cooling up to 300kW per rack or across neighboring racks, it effectively manages heat in power-intensive environments, ensuring your data center infrastructure remains optimized for next-generation workloads.
- 300 kW of cooling per SmartSense 6U unit, with scalability up to 2.1 MW in row-level configurations
- Ultra-efficient, redundant pumps operate at low speeds (3600 RPM) for quiet, efficient, and reliable performance
- Maximize GPU utilization with warm inlet temperatures up to 60°C, run at peak performance longer, accelerate computation-intensive processes and reduce time-to-solution for AI models
SmartLid: Liquid-to-Die Cooling
SmartLid targets processor hot spots directly with fluid-to-die to densify compute performance and tackle the industry’s most powerful devices. Delivering the most effective cooling for today’s CPUs, GPUs, and ASICs, SmartLids enable engineers to:
- Optimize OPEX by balancing free cooling with evaporative cooling in most climates
- Future-proof system design with the capacity to cool the next three generations of processors, including those that exceed 1,000W per chip
Discover our Product Portfolio
We’ve designed and developed a variety of liquid cooling solutions to help enterprises in their transition to liquid cooling. From liquid cold plates to integrated die cooling, our product catalog supports a broad range of needs.
NVIDIA H100 Cold Plate
Be the first to experience our fully-sealed, low-profile liquid cooling module, optimizing cooling and density for NVIDIA H100 PCIe cards, shipping Q1 2024.
SmartLid
SmartLid targets processor hot spots directly with fluid-to-die to densify compute performance and tackle the industry’s most powerful devices.
SmartSilicon
Our in-silicon cooling solution embeds directly into the chip substrate to circulate coolant and target the die’s hotspots, increasing control over chip temperatures.