We’ve engineered our technology to master a variety of demanding high heat scenarios addressing some of the toughest challenges facing high-power electronics today. Like existing cold plates, our liquid cooling modules are easily integrable to any board and chip size but, unlike traditional cold plates, they can handle the market’s highest power processors, even with very warm coolants.
Similar design, better cooling performance
Device Level Attachment
Eliminate TIM2 to minimize thermal resistance
Die Level Cooling
At or in the silicon, eliminating TIM1 and TIM2
Electric Vehicle Liquid Cooling Solutions
Small fluid jets within compact cooling modules integrate directly into the power module or inverter structure. Our patented fluid-to-package/fluid-to-die cooling techniques cool devices and minimize thermal resistance by eliminating thermal pastes and interface materials. Our compact technology taps into existing vehicle coolant loops or runs as a standalone system delivering local cooling to critical components. For custom design inquiries, including single or double-sided cooling, reach out to our team of engineers.
Great for cooling assemblies & can be part of the enclosure
Attach to the package of an existing COTS component for better cooling in a compact form factor
The ultimate in cooling with the heat exchanger embedded within the DBC substrate
Choose Custom or Off-the-Shelf Solutions
There are times when off-the-shelf products cannot meet the challenge, and that’s where JetCool’s team of engineers can help. We’re happy to modify our products to fit your system requirements. Our customized solutions can be delivered quickly, with industry-best lead times. Contact our team of engineers to get started today.
While most of our solutions are customized, we also have a library of standard products that fit many commercially available components. If you’re working with an off-the-shelf component, contact us today to discuss a matching stock solution.
We focus cooling at the chip, offering the most advanced cold plates
Our solutions are compatible with most liquid cooling infrastructure
We specialize in cooling the highest power devices with very warm coolants